增强铂修饰石墨氮化碳氧化酶活性的比色法检测抗坏血酸

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Priya Singh, Ravi Prakash Ojha, Subhajit Jana, Aniruddha Jaiswal, Rajiv Prakash
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引用次数: 0

摘要

我们提出了一种基于铂(Pt)纳米颗粒修饰的石墨氮化碳(Pt@g-C3N4)的灵敏比色传感器,用于检测实际样品中的抗坏血酸(AsA)。通过在g-C3N4分散体上还原Pt离子,合成了Pt@g-C3N4纳米复合材料,并通过各种表征技术证实了其合成。纳米复合材料表现出增强的类氧化酶活性,特别是对3,3 ',5,5 ' -四甲基联苯胺(TMB)的氧化。利用AsA对氧化酶活性的竞争性抑制,我们开发了一种比色法,用于定量醋酸缓冲液、市售片剂和实际样品(如橙汁和柠檬汁)中的AsA。该传感器在1 ~ 100 μM范围内具有良好的线性响应,检测限为0.28 μM。此外,我们还介绍了一种基于纸张的现场裸眼检测AsA的方法。这项工作为监测各种食品和药品中的AsA水平提供了一种实用且具有成本效益的方法,在卫生诊断和质量控制方面具有潜在的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhanced oxidase activity of platinum decorated graphitic carbon nitride for the colorimetric detection of ascorbic acid

We present a sensitive colorimetric sensor based on platinum (Pt) nanoparticle-decorated graphitic carbon nitride (Pt@g-C3N4) for the detection of ascorbic acid (AsA) in real samples. Pt@g-C3N4 nanocomposites were synthesized through surface reduction of Pt ions on g-C3N4 dispersions, with their synthesis confirmed by various characterization techniques. The nanocomposites exhibited enhanced oxidase-like activity, particularly in the oxidation of 3,3′,5,5′-tetramethylbenzidine (TMB). Utilizing AsA’s competitive inhibition of the oxidase activity, we developed a colorimetric assay for quantifying AsA in acetate buffer, commercially available tablets, and real samples such as orange and lemon juice. The sensor demonstrated a linear response in the 1–100 μM range, with a limit of detection of 0.28 μM. Additionally, we introduced a paper-based assay for on-site, naked-eye detection of AsA. This work offers a practical and cost-effective approach for monitoring AsA levels in various food and pharmaceutical products, with potential applications in health diagnostics and quality control.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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