用于软电子器件的微细加工导电 PEDOT:PSS 水凝胶

IF 2.9 4区 工程技术 Q2 CHEMISTRY, MULTIDISCIPLINARY
Ming Yang, Cunjiang Yu
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引用次数: 0

摘要

软电子集成了生物学、材料科学和电子工程,创造出可以与生物系统无缝连接的设备。在软性电子材料中,聚(3,4-乙烯二氧噻吩):聚苯乙烯磺酸盐(PEDOT:PSS)水凝胶以其结合的离子电子导电性、组织样力学和生物相容性而闻名。尽管有这些优点,PEDOT:PSS水凝胶仍然面临着挑战,包括高含水量、机械弱点以及与传统电子材料的粘附性有限。PEDOT:PSS与高温加工和化学要求高的制造技术的不兼容性进一步加剧了这些挑战。因此,研究越来越集中于开发具有先进制造方法的PEDOT:PSS水凝胶,以实现可扩展的生产,复杂的结构和高分辨率,以满足软电子的要求。本文从水凝胶到器件和器件到水凝胶的角度探讨了PEDOT:PSS水凝胶与软电子器件的集成。它探讨了提高PEDOT:PSS水凝胶性能和解决制造挑战的策略。研究了自顶向下(例如,可扩展制造和高精度)和自底向上(例如,可调电导率和多功能)的方法,强调了提高水凝胶与制造技术集成的进展。通过分析这些设计原则,本综述有助于基于水凝胶的微加工和软电子技术,推动生物电子学,软传感器和软机器人技术的发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Microfabricated Conductive PEDOT:PSS Hydrogels for Soft Electronics

Soft electronics integrate biology, materials science, and electronic engineering to create devices that could seamlessly interface with biological systems. Among soft electronic materials, poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) hydrogels are distinguished by their combined ionic–electronic conductivity, tissue-like mechanics, and biocompatibility. Despite these advantages, PEDOT:PSS hydrogels still face challenges, including high water content, mechanical weakness, and limited adhesion to conventional electronic materials. These challenges are further intensified by the incompatibility of PEDOT:PSS with high-temperature processing and chemically demanding fabrication techniques. Consequently, research has increasingly focused on developing PEDOT:PSS hydrogels with advanced fabrication methods that enable scalable production, complex structure, and high resolution to meet the requirements of soft electronics. This review explores the integration of PEDOT:PSS hydrogels with soft electronics from hydrogel-to-device and device-to-hydrogel perspectives. It explores strategies to enhance the performance of PEDOT:PSS hydrogels and address fabrication challenges. Both top-down (e.g., scalable fabrication and high precision) and bottom-up (e.g., tunable conductivity and multifunctionality) approaches are examined, emphasizing advances that improve hydrogel integration with manufacturing technologies. By analyzing these design principles, this review contributes to hydrogel-based microfabrication and soft electronics, driving developments in bioelectronics, soft sensors, and soft robotics.

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来源期刊
Korean Journal of Chemical Engineering
Korean Journal of Chemical Engineering 工程技术-工程:化工
CiteScore
4.60
自引率
11.10%
发文量
310
审稿时长
4.7 months
期刊介绍: The Korean Journal of Chemical Engineering provides a global forum for the dissemination of research in chemical engineering. The Journal publishes significant research results obtained in the Asia-Pacific region, and simultaneously introduces recent technical progress made in other areas of the world to this region. Submitted research papers must be of potential industrial significance and specifically concerned with chemical engineering. The editors will give preference to papers having a clearly stated practical scope and applicability in the areas of chemical engineering, and to those where new theoretical concepts are supported by new experimental details. The Journal also regularly publishes featured reviews on emerging and industrially important subjects of chemical engineering as well as selected papers presented at international conferences on the subjects.
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