用于水分散二维材料高速、无针孔、均匀湿沉积协议的快速干燥原理（Adv. Mater.）

IF 26.8 1区材料科学 Q1 CHEMISTRY, MULTIDISCIPLINARY

Advanced Materials Pub Date : 2025-04-17 DOI:10.1002/adma.202570120

Kyeonghun Jeong, Chansoo Kim, Ha Young Lee, Junyi Zhao, Soo-Hyung Choi, Jeong-A Bae, Hyun-Sik Kim, Jeong-Yeon Kim, Youjin Kim, Heechae Choi, Alloyssius E.G. Gorospe, Seung Joon Yoo, Chuan Wang, Dongwook Lee

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引用次数: 0

摘要

快速干燥流体干燥是可扩展、高速、均匀和无针孔的二维材料沉积的关键原理。使用热浸和气刀清扫（AKS），沉积速度可达0.21 m2 min - 1，超过传统方案2-4个数量级。这种方法可以扩展到一维和三维材料，如果它们在快速蒸发的液体中均匀分散。更多的细节可以在2411447号文章中找到，由川王，李东旭和同事。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Rapid Drying Principle for High-speed, Pinhole-Less, Uniform Wet Deposition Protocols of Water-Dispersed 2D Materials (Adv. Mater. 15/2025)

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Rapid Drying Principle for High-speed, Pinhole-Less, Uniform Wet Deposition Protocols of Water-Dispersed 2D Materials (Adv. Mater. 15/2025)

Rapid Drying

Rapid drying is a key principle for scalable, high-speed, uniform, and pinhole-less deposition of 2D materials. Using hot dipping and air knife sweeping (AKS), deposition speeds up to 0.21 m² min⁻¹ are achieved, surpassing conventional protocols by 2–4 orders of magnitude. This approach can extend to 1D and 3D materials if they are uniformly dispersible in rapidly evaporable liquids. More details can be found in article number 2411447 by, Chuan Wang, Dongwook Lee, and co-workers.

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来源期刊

Advanced Materials 工程技术-材料科学：综合

CiteScore

43.00

自引率

4.10%

发文量

2182

审稿时长

2 months

期刊介绍： Advanced Materials, one of the world's most prestigious journals and the foundation of the Advanced portfolio, is the home of choice for best-in-class materials science for more than 30 years. Following this fast-growing and interdisciplinary field, we are considering and publishing the most important discoveries on any and all materials from materials scientists, chemists, physicists, engineers as well as health and life scientists and bringing you the latest results and trends in modern materials-related research every week.