一种新型硅基MEMS挫折安全装置失效行为分析

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Mo Yang;Weirong Nie;He Wang;Baolin Cheng;Zhuoxiang Ning;Shenghong Lei;Yun Cao;Zhanwen Xi;Jiong Wang
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引用次数: 0

摘要

为了提高安全防护装置(S&A)的可靠性和安全性,本文对一种具有弯曲之字形轨迹的新型硅基MEMS挫折安全装置进行了失效分析。有限元分析结果表明,该装置在检测和识别冲击载荷方面是有效的。强度分析采用有限元模拟识别损伤易发部位。结果表明,微弹簧比锯齿形轨道的齿更容易损坏。通过冲击试验研究了回撤安全装置的破坏行为,对57个装置进行了88次不同方向和量级的冲击,产生了198次破坏行为。实验分析了失效行为的原因,并提出了改进措施。研究表明,它有两种失效类型:功能性失效(31.82%)和非功能性失效(68.18%)。主要的功能故障是弹簧损坏和锁错,占功能故障的87.30%。实验验证了有限元分析的损伤优先级,表明有限元分析可以作为预测功能失效的初步准则。分析表明,弹簧齿高和弹簧宽度的加工误差是导致该装置失效的重要因素,导致误锁和弹簧损坏。而非功能性故障不影响设备的基本功能,并且在没有累积损伤的情况下是可以接受的。最后,通过故障树分析,总结了回撤安全装置的失效行为,并提出了后续改进的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Failure Behavior Analysis of a Novel Silicon-Based MEMS Setback Safety Device
To improve the reliability and safety of the safety and arming device (S&A), this article presents a failure analysis of a novel silicon-based MEMS setback safety device with curved zig-zag tracks. The results of the finite element method (FEM) confirm that the setback safety device is effective in detecting and distinguishing impact loads. The strength analysis using FEM simulation identified damage-prone locations. It was determined that the microspring is more prone to damage than the tooth of the zig-zag track. The failure behavior of the setback safety device has been investigated by impact experiment, and 88 times impact on 57 devices in different directions and magnitude produced 198 times failure behaviors. The experiments analyze the causes of failure behavior and suggest ways to improve. The study shows that it has two types of failure: function (31.82%) and nonfunction failures (68.18%). The most main function failures are spring damage and mislocking, which account for 87.30% of the function failures. The experiment validated the damage prioritization of FEM analysis, indicating that the FEM can be used as a preliminary criterion for predicting function failures. It was illustrated that machining errors in tooth height and width of the spring constituted a significant factor in the device’s failure, resulting in mislocking and spring damage. While nonfunction failures do not affect the basic function of the device and are acceptable without cumulative damage. Finally, a fault tree analysis was performed to summarize the failure behaviors of the setback safety device, and the methods for subsequent improvements are proposed.
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来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
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