Enhanced EMI shielding performance of glass fiber fabric via optimized electroless copper deposition

The increasing use of electronic devices necessitates the development of high-performance electromagnetic interference (EMI) shielding materials. Lightweight, flexible, and adaptable shields are essential for various applications, including wearable electronics and communication systems. This study reports on fabricating such materials using conductive glass fiber fabric (GFF) via electroless copper (Cu) deposition. The GFF substrate was selected for its advantageous properties, such as high tensile strength, heat resistance, fire resistance, durability, and low weight, making it well-suited for EMI shielding applications. The influence of deposition temperature (20–60 °C) on the morphology, thickness, electrical conductivity, and EMI shielding effectiveness (SE) of the Cu-deposited GFF was systematically investigated. At the optimal deposition temperature of 50 °C, a dense and uniform Cu coating, measuring 8.02 µm in thickness, was deposited onto the 80 µm thick GFF, a density of 3.23 g/cm³, a maximum electrical conductivity of 6.41 × 10⁵ S/m, and maximized mass gain, indicating efficient Cu deposition. Furthermore, the Cu-deposited GFF exhibited enhanced thermal stability, retaining 99.6 % of its mass at 900 °C. This optimized Cu-deposited GFF demonstrated a remarkable total shielding effectiveness (SE_T) of 74.59 dB, with a shielding effectiveness due to absorption (SE_A) of 53.95 dB and a shielding effectiveness due to reflection (SE_R) of 20.64 dB. The enhanced EMI SE_T is attributed to the increased Cu thickness, improved surface coverage, enhanced crystallinity, and strong interfacial interactions at the optimal deposition temperature. This electroless Cu deposition method effectively produces high-performance EMI shielding materials suitable for diverse electronics, communication systems, and smart textile applications.