TIADC信道间失配校正算法

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Chengjie Wang, Shengmin Yang, Yuhua Liang
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引用次数: 0

摘要

针对现有标定算法中存在的标定精度、硬件利用率或标定速度与精度之间的权衡问题,本文提出了一种包含并行和串行架构的全数字化后台标定方法,该方法可以降低硬件利用率,并支持扩展到任意数量的通道。我们在FPGA上对所提出的算法进行了板级验证。FPGA板级验证结果与MATLAB行为仿真结果吻合。在输入频率为0.025 fs时,SNDR和SFDR分别提高了8.59 dB和11.54 dB,有效比特数(ENOB)提高了1.42 bits。在0.05 fs的输入频率下,SNDR和SFDR分别提高了20.89 dB和13.65 dB, ENOB提高了2.27 bits。在0.2 fs输入频率下,SNDR和SFDR分别提高了11.86 dB和17.89 dB, ENOB提高了1.97 bits。输出布局尺寸为500 μm × 550 μm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Algorithm of the inter-channel mismatches calibration in TIADC
To address the issues in existing algorithms related to calibration accuracy, hardware utilization, or the trade-off between calibration speed and accuracy, this paper proposes a fully digital background calibration method including parallel and serial architecture, which can reduce hardware utilization and supports the expansion to an arbitrary number of channels.
We performed board-level verification on an FPGA for the proposed algorithm. The results of the FPGA board-level verification match those of the MATLAB behavioral simulation. At an input frequency of 0.025 fs, the SNDR and SFDR improved by 8.59 dB and 11.54 dB, respectively, and the effective number of bits (ENOB) increased by 1.42 bits. At an input frequency of 0.05 fs, the SNDR and SFDR improved by 20.89 dB and 13.65 dB, respectively, and the ENOB increased by 2.27 bits. At an input frequency of 0.2 fs, the SNDR and SFDR improved by 11.86 dB and 17.89 dB, respectively, and the ENOB increased by 1.97 bits. The output layout size was 500 μm × 550 μm.
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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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