{"title":"电沉积铁镍钨钼锰高熵合金:合成、表征和退火","authors":"V. Divya, R. Kannan, R. Sengodan","doi":"10.1007/s10854-025-14714-1","DOIUrl":null,"url":null,"abstract":"<div><p>The electrodeposition method was used for FeNiWMoMn – High-entropy alloy (HEA) coating on a Copper substrate in an aqueous medium. The temperature was set at 75 °C and the deposition time was varied as 30 min, 60 min, and 90 min with a constant current density of 1A/dm<sup>2</sup>. The 60-min deposited films were exposed to one hour of annealing at 200 °C to study the effects on their magnetic and structural properties. FeNiWMoMn alloy coatings were characterized using X-ray diffraction (XRD), Field Emission Scanning Electron Microscopy (FESEM), Energy Dispersive X-ray spectroscopy (EDS) and Electrochemical Impedance Spectroscopy (EIS). From the X-ray diffraction analysis, it was observed that they exhibit a cubic crystal structure. The crystalline size measured 27 nm, 26 nm, and 25 nm for deposition times of 30, 60, and 90 min, respectively. Annealed indicates increased crystallite size and reduced dislocation density, contributing to improved mechanical properties. The EDS results confirm that the sample has all of the required elements. The atomic weight percentage of Ni and Fe increases as the deposition period increases, whereas W and Mn decrease. The corrosion rate of coated FeNiWMoMn high-entropy alloy increases as the deposition time increases. The polarization resistance values start to decrease. After Annealing corrosion rate decreased and polarization resistance increased. The surface roughness properties of synthesized alloy are also investigated using AFM and found that the surface roughness of FeNiWMoMn alloy reduces as deposition time increases. Annealing improves the properties of Ni–Fe–W–Mo–Mn thin films for advanced applications.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 11","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electrodeposited FeNiWMoMn high-entropy alloys: synthesis, characterization, and annealed\",\"authors\":\"V. Divya, R. Kannan, R. Sengodan\",\"doi\":\"10.1007/s10854-025-14714-1\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The electrodeposition method was used for FeNiWMoMn – High-entropy alloy (HEA) coating on a Copper substrate in an aqueous medium. The temperature was set at 75 °C and the deposition time was varied as 30 min, 60 min, and 90 min with a constant current density of 1A/dm<sup>2</sup>. The 60-min deposited films were exposed to one hour of annealing at 200 °C to study the effects on their magnetic and structural properties. FeNiWMoMn alloy coatings were characterized using X-ray diffraction (XRD), Field Emission Scanning Electron Microscopy (FESEM), Energy Dispersive X-ray spectroscopy (EDS) and Electrochemical Impedance Spectroscopy (EIS). From the X-ray diffraction analysis, it was observed that they exhibit a cubic crystal structure. The crystalline size measured 27 nm, 26 nm, and 25 nm for deposition times of 30, 60, and 90 min, respectively. Annealed indicates increased crystallite size and reduced dislocation density, contributing to improved mechanical properties. The EDS results confirm that the sample has all of the required elements. The atomic weight percentage of Ni and Fe increases as the deposition period increases, whereas W and Mn decrease. The corrosion rate of coated FeNiWMoMn high-entropy alloy increases as the deposition time increases. The polarization resistance values start to decrease. After Annealing corrosion rate decreased and polarization resistance increased. The surface roughness properties of synthesized alloy are also investigated using AFM and found that the surface roughness of FeNiWMoMn alloy reduces as deposition time increases. Annealing improves the properties of Ni–Fe–W–Mo–Mn thin films for advanced applications.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"36 11\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2025-04-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-025-14714-1\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14714-1","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
摘要
在水性介质中,采用电沉积法在铜基底上形成铁镍钼锰-高熵合金(HEA)涂层。温度设定为 75 °C,沉积时间分别为 30 分钟、60 分钟和 90 分钟,电流密度恒定为 1A/dm2。沉积 60 分钟的薄膜在 200 °C 下退火一小时,以研究其对磁性和结构特性的影响。使用 X 射线衍射 (XRD)、场发射扫描电子显微镜 (FESEM)、能量色散 X 射线光谱 (EDS) 和电化学阻抗光谱 (EIS) 对铁镍钼锰合金涂层进行了表征。从 X 射线衍射分析中可以看出,它们呈现立方晶体结构。沉积时间为 30、60 和 90 分钟时,晶体尺寸分别为 27 纳米、26 纳米和 25 纳米。退火表明晶粒尺寸增大,位错密度降低,从而提高了机械性能。EDS 结果证实,样品含有所需的全部元素。随着沉积时间的延长,镍和铁的原子量百分比增加,而钨和锰则减少。镀层 FeNiWMoMn 高熵合金的腐蚀速率随着沉积时间的延长而增加。极化电阻值开始下降。退火后,腐蚀速率降低,极化电阻增加。我们还使用原子力显微镜研究了合成合金的表面粗糙度特性,发现随着沉积时间的延长,FeNiWMoMn 合金的表面粗糙度降低。退火改善了镍-铪-钨-钼-锰薄膜的性能,使其更适合先进应用。
Electrodeposited FeNiWMoMn high-entropy alloys: synthesis, characterization, and annealed
The electrodeposition method was used for FeNiWMoMn – High-entropy alloy (HEA) coating on a Copper substrate in an aqueous medium. The temperature was set at 75 °C and the deposition time was varied as 30 min, 60 min, and 90 min with a constant current density of 1A/dm2. The 60-min deposited films were exposed to one hour of annealing at 200 °C to study the effects on their magnetic and structural properties. FeNiWMoMn alloy coatings were characterized using X-ray diffraction (XRD), Field Emission Scanning Electron Microscopy (FESEM), Energy Dispersive X-ray spectroscopy (EDS) and Electrochemical Impedance Spectroscopy (EIS). From the X-ray diffraction analysis, it was observed that they exhibit a cubic crystal structure. The crystalline size measured 27 nm, 26 nm, and 25 nm for deposition times of 30, 60, and 90 min, respectively. Annealed indicates increased crystallite size and reduced dislocation density, contributing to improved mechanical properties. The EDS results confirm that the sample has all of the required elements. The atomic weight percentage of Ni and Fe increases as the deposition period increases, whereas W and Mn decrease. The corrosion rate of coated FeNiWMoMn high-entropy alloy increases as the deposition time increases. The polarization resistance values start to decrease. After Annealing corrosion rate decreased and polarization resistance increased. The surface roughness properties of synthesized alloy are also investigated using AFM and found that the surface roughness of FeNiWMoMn alloy reduces as deposition time increases. Annealing improves the properties of Ni–Fe–W–Mo–Mn thin films for advanced applications.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.