换热器管腔声共振机理的实验与数值研究

IF 2.6 3区工程技术 Q2 ENGINEERING, MECHANICAL

International Journal of Heat and Fluid Flow Pub Date : 2025-04-12 DOI:10.1016/j.ijheatfluidflow.2025.109838

Sheng Tian, Guofeng Huang, Wei Tan

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引用次数: 0

摘要

本文将换热管简化为单圆筒，并通过实验和数值模拟相结合的方法研究了单圆筒的声共振机理。研究发现，对于直径为 12 mm 的圆筒，声共振时的峰值声压达到 5.53 Pa，波动速度达到 0.7 m/s。同时，随着直径的增大，声共振开始的时间也会推迟，直到达到更高的流速--从直径为 10 毫米的圆柱体的约 20.8 米/秒到直径为 14 毫米的圆柱体的 30 米/秒。数值模拟通过调整数值边界条件分析了声共振期间流场的演变。结果表明，扰动幅度对气缸表面的升力系数有显著影响。当采用 U0 的 10% 的扰动时，升力系数振幅比未扰动情况下增加了 32.73%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Experimental and numerical investigation of the acoustic resonance mechanism of the heat exchanger tube

In this paper, the heat exchanger tube is simplified as a single cylinder and the acoustic resonance mechanism of the single cylinder is investigated by a combination of experiments and numerical simulations. It is found that the peak acoustic pressure during acoustic resonance reaches 5.53 Pa and the fluctuation velocity reaches 0.7 m/s for a cylinder with a diameter of 12 mm. At the same time, the onset of acoustic resonance is delayed as the diameter increases until a higher flow velocity is reached − from about 20.8 m/s for a cylinder with a diameter of 10 mm to 30 m/s for a cylinder with a diameter of 14 mm. Numerical simulations analysed the evolution of the flow field during acoustic resonance by adjusting the numerical boundary conditions. The results show that the perturbation amplitude has a significant effect on the lift coefficient at the cylinder surface. When a perturbation of 10 % of U₀ is applied, the lift coefficient amplitude increases by 32.73 % compared to the undisturbed case.

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来源期刊

International Journal of Heat and Fluid Flow 工程技术-工程：机械

CiteScore

5.00

自引率

7.70%

发文量

131

审稿时长

33 days

期刊介绍： The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.