{"title":"低温共烧陶瓷用玻璃/堇青石/hBN复合材料的制备与表征","authors":"Oğuzhan Bilaç, Gülsüm Topateş, Cihangir Duran","doi":"10.1016/j.ceramint.2024.12.210","DOIUrl":null,"url":null,"abstract":"<div><div>Commercial glass/cordierite/nano hexagonal boron nitride (hBN) filler composites were successfully fabricated for low-temperature co-fired ceramics applications. These composites meet the requirements such as densification temperatures below 950 °C, high thermal conductivity for effective heat dissipation, a thermal expansion coefficient matched to silicon for enhanced reliability, and a low dielectric constant for high signal transmission speed. Densification temperatures for all composites were ≤875 °C, attributed to the viscous sintering of the glass matrix. The number of closed pores increased with the hBN content, limiting the expected property improvements. However, very low apparent porosity (0.75 %) glass/cordierite/hBN (10 wt%) composite achieved a thermal expansion coefficient of 2.17 ppm/°C between 25 and 200 °C, a thermal conductivity of 1.72 W/m·K at 25 °C and a dielectric constant (loss) of 5.01 (0.0067) at 5 MHz. These properties are comparable to commercial low-temperature co-fired ceramics products.</div></div>","PeriodicalId":267,"journal":{"name":"Ceramics International","volume":"51 10","pages":"Pages 12381-12386"},"PeriodicalIF":5.1000,"publicationDate":"2025-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Production and characterization of glass/cordierite/hBN composites for low temperature co-fired ceramic applications\",\"authors\":\"Oğuzhan Bilaç, Gülsüm Topateş, Cihangir Duran\",\"doi\":\"10.1016/j.ceramint.2024.12.210\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>Commercial glass/cordierite/nano hexagonal boron nitride (hBN) filler composites were successfully fabricated for low-temperature co-fired ceramics applications. These composites meet the requirements such as densification temperatures below 950 °C, high thermal conductivity for effective heat dissipation, a thermal expansion coefficient matched to silicon for enhanced reliability, and a low dielectric constant for high signal transmission speed. Densification temperatures for all composites were ≤875 °C, attributed to the viscous sintering of the glass matrix. The number of closed pores increased with the hBN content, limiting the expected property improvements. However, very low apparent porosity (0.75 %) glass/cordierite/hBN (10 wt%) composite achieved a thermal expansion coefficient of 2.17 ppm/°C between 25 and 200 °C, a thermal conductivity of 1.72 W/m·K at 25 °C and a dielectric constant (loss) of 5.01 (0.0067) at 5 MHz. These properties are comparable to commercial low-temperature co-fired ceramics products.</div></div>\",\"PeriodicalId\":267,\"journal\":{\"name\":\"Ceramics International\",\"volume\":\"51 10\",\"pages\":\"Pages 12381-12386\"},\"PeriodicalIF\":5.1000,\"publicationDate\":\"2025-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Ceramics International\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0272884224058723\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, CERAMICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ceramics International","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0272884224058723","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
Production and characterization of glass/cordierite/hBN composites for low temperature co-fired ceramic applications
Commercial glass/cordierite/nano hexagonal boron nitride (hBN) filler composites were successfully fabricated for low-temperature co-fired ceramics applications. These composites meet the requirements such as densification temperatures below 950 °C, high thermal conductivity for effective heat dissipation, a thermal expansion coefficient matched to silicon for enhanced reliability, and a low dielectric constant for high signal transmission speed. Densification temperatures for all composites were ≤875 °C, attributed to the viscous sintering of the glass matrix. The number of closed pores increased with the hBN content, limiting the expected property improvements. However, very low apparent porosity (0.75 %) glass/cordierite/hBN (10 wt%) composite achieved a thermal expansion coefficient of 2.17 ppm/°C between 25 and 200 °C, a thermal conductivity of 1.72 W/m·K at 25 °C and a dielectric constant (loss) of 5.01 (0.0067) at 5 MHz. These properties are comparable to commercial low-temperature co-fired ceramics products.
期刊介绍:
Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties.
Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour.
Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.