磁介电协同珊瑚样CoNi@SiO2微粒,用于高效宽带微波吸收

IF 5.1 2区 材料科学 Q1 MATERIALS SCIENCE, CERAMICS
Jiale Wu , Jin Hu , Zhongshan Deng , Yongjin Feng , Kaijun Wang , Zhiyi Wang , Junkai Li , Kaizhao Wang
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引用次数: 0

摘要

磁介电功能材料具有独特的三维各向异性结构、合理的组分调节和分层非均质界面,是实现高效微波吸收的潜在候选材料。本文通过Stöber溶胶-凝胶法锚定介电SiO2层调节介电常数εr,合成了高性能MA用的CoNi/SiO2杂化材料。结果表明:珊瑚状球形结构丰富的孔隙和高比表面积、SiO2壳层对CoNi合金的εr调制、非均质界面及其电荷存储容量的差异,为入射电磁波(EMW)提供了更多的反射和散射通道,优化了阻抗匹配,增强了界面极化损耗和磁损耗;最终实现反射损耗(RL)的增强和有效吸收带宽(EAB)的展宽。其中,珊瑚状CoNi@SiO2-2微粒(MP)在2.2 mm匹配厚度下的RL最强,为−66.59 dB,在1.9 mm匹配厚度下的EAB最大,为6.460 GHz,覆盖了整个ku波段。本研究通过独特的形貌设计和引入介电锚定层构建了层次化异质结构,为利用磁-介电耦合工程制备高效吸波材料提供了一条新途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Magnetic-dielectric synergistic coral-like CoNi@SiO2 microparticles for high-efficiency and broadband microwave absorption
Magnetic-dielectric functional materials with unique three-dimensional (3D) anisotropic structures, reasonable component regulation, and hierarchical heterogeneous interfaces are potential candidates for achieving efficient microwave absorption (MA). In this paper, CoNi/SiO2 hybrids are synthesized for high-performance MA by anchoring the dielectric SiO2 layer by Stöber's sol-gel method to regulate the permittivity (εr). The results show that the abundant pores and high specific surface area of the coral-like spherical structure, the εr modulation of CoNi alloy by SiO2 shell-layer, the heterogeneous interface and charge storage capacity difference between both, which provide more reflective and scattering channels for the incident electromagnetic wave (EMW), optimize the impedance matching and enhance the interfacial polarization loss and magnetic loss, and finally achieve the reflection loss (RL) enhancement and effective absorption bandwidth (EAB) broadening. In particular, the coral-like CoNi@SiO2-2 microparticle (MP) has the strongest RL of −66.59 dB at 2.2 mm matching thickness and the maximum EAB of 6.460 GHz at 1.9 mm matching thickness, which covers the entire Ku-band. In this study, the hierarchical heterostructure is constructed by a unique morphology design and the introduction of a dielectric anchoring layer, which provides a new way to prepare efficient microwave-absorbing materials by magnetic-dielectric coupling engineering.
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来源期刊
Ceramics International
Ceramics International 工程技术-材料科学:硅酸盐
CiteScore
9.40
自引率
15.40%
发文量
4558
审稿时长
25 days
期刊介绍: Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties. Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour. Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.
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