用于ZnO/NiO异质结太阳能电池的ZnO薄膜的优化

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Atanu Samanta, Praloy Mondal
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引用次数: 0

摘要

本研究探讨了ZnO/NiO结的制备和分析以及al掺杂ZnO (AZO)薄膜的电学性能。ZnO/NiO结是在Ar-O2气氛中反应共溅射制备的,而AZO薄膜是在衬底温度(TS)为50 ~ 400℃的条件下通过射频磁控溅射生长的。在这个温度范围内,AZO薄膜的可见光透过率变化很大,从2%到85%不等。在较低温度下(~ 50°C)沉积的薄膜表现出明显的非化学计量,而在较高温度下(~ 400°C)沉积的薄膜则表现出化学计量。室温下生长的氧化镍薄膜的透过率超过80%,而室温下沉积的AZO薄膜表现出简并性,载流子浓度为~ 1021 cm⁻3。在ITO玻璃上制备的p型NiO/n型AZO异质结太阳能电池,在400°C下沉积AZO,效率为4.5%,开路电压为844 mV,短路电流密度为11.3 mA/cm2,突出了其在透明太阳能电池中的应用潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of ZnO films for the development of ZnO/NiO heterojunction solar cells

This study explores the fabrication and analysis of ZnO/NiO junctions and the electrical properties of Al-doped ZnO (AZO) films. ZnO/NiO junctions were prepared using reactive co-sputtering in an Ar–O2 atmosphere, while AZO films were grown via RF magnetron sputtering at substrate temperatures (TS) ranging from 50 to 400 °C. The visible transmission of AZO films varied significantly, from 2 to 85%, across this temperature range. Films deposited at lower temperatures (~ 50 °C) exhibited pronounced non-stoichiometry, whereas those at higher temperatures (~ 400 °C) were stoichiometric. Nickel oxide films grown at room temperature (RT) achieved exceptional transmittance exceeding 80%, while RT-deposited AZO films demonstrated degenerate properties with a carrier concentration of ~ 1021 cm⁻3. A p-type NiO/n-type AZO heterojunction solar cell on ITO glass, with AZO deposited at 400 °C, achieved 4.5% efficiency, an open-circuit voltage of 844 mV, and a short-circuit current density of 11.3 mA/cm2, highlighting its potential for transparent solar cell applications.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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