带通孔的 K 波段铌酸锂 A3 兰姆波谐振器

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Shu-Mao Wu;Hao Yan;Chen-Bei Hao;Zhen-Hui Qin;Si-Yuan Yu;Yan-Feng Chen
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引用次数: 0

摘要

针对兰姆波谐振器的关键挑战,本文首次验证了采用通孔的谐振器。以工作在K波段的基于LiNbO3单晶薄膜的A3模式谐振器为例,说明了通孔设计的优点。在没有额外加工步骤的情况下,在不引入额外杂散模式的情况下,在保持器件性能(包括工作频率、机电耦合系数和质量因子)的同时,该方法有效地减少了压电LiNbO3薄膜的无效悬浮面积,潜在地提高了机械和热稳定性。它还标准化了在单个晶圆上跨各种兰姆波谐振器的蚀刻距离(和时间),促进了兰姆波滤波器的开发。通孔技术的通用性,以及对孔的几何形状和布置的宽松限制,进一步凸显了它的重要性。与其他优点一起,这些特点强调了通孔在推进兰姆波谐振器和滤波器的实际实施方面的变革潜力。(2024 - 0155)
本文章由计算机程序翻译,如有差异,请以英文原文为准。
K-Band LiNbO₃ A3 Lamb-Wave Resonators With Through-Holes
Addressing critical challenges in Lamb wave resonators, this paper presents the first validation of resonators incorporating through-holes. Using the A3 mode resonator based on a LiNbO3 single-crystal thin film and operating in the K band as a prominent example, we demonstrate the advantages of the through-hole design. In the absence of additional processing steps, and while maintaining device performance—including operating frequency, electromechanical coupling coefficient, and quality factor—without introducing extra spurious modes, this approach effectively reduces the ineffective suspension area of the piezoelectric LiNbO3 film, potentially enhancing mechanical and thermal stability. It also standardizes etching distances (and times) across various Lamb wave resonators on a single wafer, facilitating the development of Lamb wave filters. The versatility of the through-hole technique, with relaxed constraints on hole geometry and arrangement, further highlights its significance. Together with the other advantages, these features underscore the transformative potential of through-holes in advancing the practical implementation of Lamb wave resonators and filters. [2024-0155]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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