基于欺骗表面等离子激元极化子的高带外抑制宽带平面滤波天线

IF 3.7 2区计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Antennas and Wireless Propagation Letters Pub Date : 2024-12-24 DOI:10.1109/LAWP.2024.3522125

Jia Jun Sheng;Chang Jiang You;Qin Yu Li;Xin Hao Liu;Han Li Peng;Xue Yong Zhu

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引用次数: 0

摘要

本文提出了一种基于欺骗表面等离子激元极化子（SSPP）的宽带、低姿态平面滤波天线。在对称SSPP单元之间加载周期性间隙，作为天线的辐射元件。该天线得益于SSPP辐射元件的色散特性，因此实现了宽带上的高效辐射。利用SSPP的高频截止特性获得滤波性能。为了验证该方法，设计并制作了一个低轮廓仅为0.012λ0的原型。仿真结果与实测结果吻合良好，阻抗带宽达50.6% [(5.16 ~ 8.32)GHz]，峰值增益达7.45 dBi，下阻带和上阻带的带外抑制水平分别为18 dB和6.3 dB。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Broadband Planar Filtering Antenna With High Out-of-Band Suppression Based on Spoof Surface Plasmon Polariton

This letter proposed a broadband, low-profile, and planar filtering antenna based on spoof surface plasmon polariton (SSPP). Periodic gaps are loaded between symmetric SSPP units to serve as a radiator element of the antenna. The antenna benefits from the dispersion characteristics of the SSPP radiator element, so efficient radiation over broadband has been achieved. The high-frequency cut-off characteristics of SSPP are also employed to obtain filtering performance. To verify the method, a prototype with a low profile of only 0.012λ₀ is designed and fabricated. The simulated and measured results agree well with each other, demonstrating good performances with large impedance bandwidth of 50.6% [(5.16 to 8.32) GHz], high peak gain of 7.45 dBi, together with high out-of-band suppression levels of about 18 dB in the lower stopband and 6.3 dB in the upper stopband.

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来源期刊

IEEE Antennas and Wireless Propagation Letters 工程技术-电信学

CiteScore

8.00

自引率

9.50%

发文量

529

审稿时长

1.0 months

期刊介绍： IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.