{"title":"SIW腔馈毫米波圆极化滤波器启用定制设计的贴片","authors":"Zhiyuan Chen;Zi-Hao Bian;Kun-Zhi Hu;Fan Yang;De-Yi Xiong;Dajiang Li;Min Xiang","doi":"10.1109/LAWP.2024.3523920","DOIUrl":null,"url":null,"abstract":"In this letter, a millimeter-wave circularly polarized filtenna enabled with custom-designed patches is presented. The configuration of the filtenna is simple, which consists of an I-shaped substrate integrated waveguide (SIW) cavity, four square patches etched with cross slots, L-shaped stubs that are connected to the square patches, and regularly arranged shorting vias. The filtering response with controllable radiation nulls is facilitated by the I-shaped SIW cavity. The regularly-arranged shorting vias play a crucial role in the creation of an axial ratio (AR) minimum for the filtenna. Four square patches etched with cross slots contribute to the generation of the other two AR minima in the passband. Thus, a wide AR bandwidth is achieved. The gain value of the filtenna is ultimately enhanced by the introduction of L-shaped stubs, which alters the current distributions of the top patches. A prototype of the developed filtenna is fabricated and measured for validation. The measured results demonstrate an overlapped fractional bandwidth (where |<italic>S</i><sub>l1</sub>| ≤ −10 dB and AR ≤ 3 dB) of 11.2% [(24.1 to 26.95) GHz] and a peak realized gain value of 10.4 dBi.","PeriodicalId":51059,"journal":{"name":"IEEE Antennas and Wireless Propagation Letters","volume":"24 4","pages":"998-1002"},"PeriodicalIF":3.7000,"publicationDate":"2024-12-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"SIW Cavity-Fed Millimeter-Wave Circularly Polarized Filtenna Enabled With Custom-Designed Patches\",\"authors\":\"Zhiyuan Chen;Zi-Hao Bian;Kun-Zhi Hu;Fan Yang;De-Yi Xiong;Dajiang Li;Min Xiang\",\"doi\":\"10.1109/LAWP.2024.3523920\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this letter, a millimeter-wave circularly polarized filtenna enabled with custom-designed patches is presented. The configuration of the filtenna is simple, which consists of an I-shaped substrate integrated waveguide (SIW) cavity, four square patches etched with cross slots, L-shaped stubs that are connected to the square patches, and regularly arranged shorting vias. The filtering response with controllable radiation nulls is facilitated by the I-shaped SIW cavity. The regularly-arranged shorting vias play a crucial role in the creation of an axial ratio (AR) minimum for the filtenna. Four square patches etched with cross slots contribute to the generation of the other two AR minima in the passband. Thus, a wide AR bandwidth is achieved. The gain value of the filtenna is ultimately enhanced by the introduction of L-shaped stubs, which alters the current distributions of the top patches. A prototype of the developed filtenna is fabricated and measured for validation. The measured results demonstrate an overlapped fractional bandwidth (where |<italic>S</i><sub>l1</sub>| ≤ −10 dB and AR ≤ 3 dB) of 11.2% [(24.1 to 26.95) GHz] and a peak realized gain value of 10.4 dBi.\",\"PeriodicalId\":51059,\"journal\":{\"name\":\"IEEE Antennas and Wireless Propagation Letters\",\"volume\":\"24 4\",\"pages\":\"998-1002\"},\"PeriodicalIF\":3.7000,\"publicationDate\":\"2024-12-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Antennas and Wireless Propagation Letters\",\"FirstCategoryId\":\"94\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10818415/\",\"RegionNum\":2,\"RegionCategory\":\"计算机科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Antennas and Wireless Propagation Letters","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10818415/","RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
SIW Cavity-Fed Millimeter-Wave Circularly Polarized Filtenna Enabled With Custom-Designed Patches
In this letter, a millimeter-wave circularly polarized filtenna enabled with custom-designed patches is presented. The configuration of the filtenna is simple, which consists of an I-shaped substrate integrated waveguide (SIW) cavity, four square patches etched with cross slots, L-shaped stubs that are connected to the square patches, and regularly arranged shorting vias. The filtering response with controllable radiation nulls is facilitated by the I-shaped SIW cavity. The regularly-arranged shorting vias play a crucial role in the creation of an axial ratio (AR) minimum for the filtenna. Four square patches etched with cross slots contribute to the generation of the other two AR minima in the passband. Thus, a wide AR bandwidth is achieved. The gain value of the filtenna is ultimately enhanced by the introduction of L-shaped stubs, which alters the current distributions of the top patches. A prototype of the developed filtenna is fabricated and measured for validation. The measured results demonstrate an overlapped fractional bandwidth (where |Sl1| ≤ −10 dB and AR ≤ 3 dB) of 11.2% [(24.1 to 26.95) GHz] and a peak realized gain value of 10.4 dBi.
期刊介绍:
IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.