模式局域共振加速度计的动态特性

IF 2.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Microelectromechanical Systems Pub Date : 2025-02-26 DOI:10.1109/JMEMS.2025.3541581

Bowen Wang;Kunfeng Wang;Zhenxiang Qi;Zhaoyang Zhai;Zheng Wang;Xudong Zou

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引用次数: 0

摘要

本文研究了模式局域共振加速度计（ML-RXL）在小信号和大信号模型下的动态特性。推导了各幅值比（AR）工作点（OPs）下ML-RXL带宽的解析模型，并通过仿真和实验进行了验证。对于小信号模型，具有更大AR的OP导致ML-RXL的带宽进一步拓宽。具体来说，当AR从1扩展到4时，有效带宽从46Hz扩展到152Hz。对于大信号模型，本研究揭示了AR输出响应曲线中出现多个谐波峰值，在给定的op下，随着动态加速度信号强度的增加，谐波峰值变得更加明显。研究结果表明，ML-RXL的带宽受模态频率差和动态加速度信号强度的约束，可以通过调整工作点来扩大带宽。(2024 - 0209)

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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The Dynamic Characteristics of a Mode-Localized Resonant Accelerometer

This paper investigates the dynamic characteristics of the mode-localized resonant accelerometer (ML-RXL) both in small-signal and large-signal models. The analytical model of ML-RXL bandwidth at various amplitude ratio (AR) operating points (OPs) was derived and validated through simulations and experiments. For the small-signal model, the OP with larger AR results in a further broadening of the ML-RXL’s bandwidth. Specifically, when AR is from 1 to 4, the effective bandwidth is expanded from 46Hz to 152Hz. For large-signal model, this study reveals the emergence of multiple harmonic peaks in the AR output response curve, which become more pronounced as the intensity of the dynamic acceleration signal increases at a given OP. The findings indicate that the bandwidth of ML-RXL is constrained by mode frequency difference and dynamic acceleration signal intensity, and it can be expanded by adjusting the operating point. [2024-0209]

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来源期刊

Journal of Microelectromechanical Systems 工程技术-工程：电子与电气

CiteScore

6.20

自引率

7.40%

发文量

115

审稿时长

7.5 months

期刊介绍： The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.