具有超低偏压下高介电可调性的钡铁氧体薄膜

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Xiaoting Li, Shuang Lv, Zhengguan Dai, Yuzheng He, Zongrong Wang, Ning Ma, Piyi Du
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引用次数: 0

摘要

采用溶胶-凝胶和旋涂法制备了钡铁氧体(BaFeO12)薄膜,其钡离子的化学计量比为Ba/Fe = x/12 (x = 1.0 ~ 3.0)。结果表明:薄膜中密集形成了100 ~ 200nm大小的棒状铁素体晶粒;在薄膜中控制铁素体相的(00 l)取向形成。过量的Ba2+存在于晶格中,并掺杂在三角形、双锥或八面体间隙的间隙位置。掺杂Ba2+后产生Fe2+/Fe3+对电子偶极子,先增大后减小。溶胶前驱体中Fe2+/Fe3+偶极子在Ba:Fe = 2:12的超化学比下制备的4层薄膜中含量最高,在~ 200 V/cm的超低直流偏压下,10 kHz时的介电可调性高达69%,介电损耗为0.03,FOM为21.6。钡铁氧体薄膜在超低电场条件下的高可调谐性和低损耗在介质可调谐器件中具有广阔的应用前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Interstitial Ba2+ ions doped (00 l) oriented barium ferrite thin film with high dielectric tunability under ultra-low bias for microwave applications

The barium ferrites (BaFeO12) thin films with barium ions of over stoichiometry ratio of Ba/Fe = x/12 (x = 1.0–3.0) in sol precursor were successfully prepared on silicon substrates by sol–gel and spin-coating method. Results show that the rod-like ferrite grains of 100 ~ 200 nm in size were formed densely in the thin film. The (00 l) orientation of the ferrite phase was controlled to form in the thin film. Excess Ba2+ existed in cell lattice and doped in the interstitial sites of triangular biconical or octahedral interstices. Fe2+/Fe3+ electron pair dipoles were generated by doping Ba2+, increasing initially and decreasing finally. The highest content of Fe2+/Fe3+ dipoles appeared in the 4-layered thin film prepared with over stoichiometry ratio of Ba:Fe = 2:12 in sol precursor, contributing a highest dielectric tunability of 69%, low dielectric loss of 0.03 and FOM of 21.6 at 10 kHz under super low DC bias of ~ 200 V/cm. Such high tunability and low loss under super low electric field in the barium ferrite thin films show great potential for novel applications in dielectric tunable devices.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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