基于多目标优化算法的 ±550 千伏直流 GIS 绝缘结构设计

IF 2.9 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Boya Zhang;Haifei Tao;Yixuan Li;Xingwen Li;Zhenle Nan;Wei Luo;Yao Zheng;Guoli Wang
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引用次数: 0

摘要

在高压直流气体绝缘开关设备(HVdc GIS)中,绝缘子表面电荷积累的问题一直受到人们的关注,限制了高压直流气体绝缘开关设备的发展。本研究提出了一种基于多目标优化方法的绝缘结构优化方法,以平衡绝缘子表面切向电场和法向电场,减轻局部电应力,实现高效、精确的GIS绝缘结构设计。优化目标包括切向电场和表面电荷密度。采用非支配排序遗传算法II (NSGA-II)和响应面法(RSM)对±550 kv直流GIS的锥形绝缘子和屏蔽结构进行优化。此外,研究了间隙距离对绝缘子表面电荷和电场分布的影响。最终,根据绝缘优化设计准则,实现了±550 kv GIS的最优结构和间隙距离,为HVdc GIS的绝缘设计提供了重要的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Insulation Structure Design for ±550-kV DC GIS Based on Multiobjective Optimization Algorithm
In high-voltage direct current gas-insulated switchgear (HVdc GIS), the problem of surface charge accumulation on insulators has garnered significant attention, limiting the development of dc GIS at high voltage levels. This study proposes an insulation structure optimization method based on a multiobjective optimization method to balance the tangential and normal electric fields on the insulator surface and mitigate local electric stress, achieving efficient and precise GIS insulation structure design. The optimization objectives include the tangential electric field and surface charge density. The study utilizes nondominated sorting genetic algorithm II (NSGA-II) and response surface methodology (RSM) to obtain the optimal structure for the conical insulator and shield of ±550-kV dc GIS. In addition, the study investigates the impact of gap distance on the surface charge and electric field distribution of the insulator. Ultimately, following insulation optimization design criteria, the study achieves the optimal structure and gap distance for ±550-kV GIS, providing crucial insights for the insulation design of HVdc GIS.
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来源期刊
IEEE Transactions on Dielectrics and Electrical Insulation
IEEE Transactions on Dielectrics and Electrical Insulation 工程技术-工程:电子与电气
CiteScore
6.00
自引率
22.60%
发文量
309
审稿时长
5.2 months
期刊介绍: Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.
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