具有轻微逆压梯度的边界层入口流动的湍流驱动

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL
Ehsan Asgari, Mohammad Saeedi
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引用次数: 0

摘要

在本文中,我们提出了一种上游跳闸方法,用于大涡模拟中由于逆压梯度而分离的边界层湍流产生。采用高阶谱元法进行数值模拟,在结构入口边界附近有一个弧形行程,逆压梯度较小。我们研究了行程高度、位置、数量以及入口速度分布对下游流动特性的影响。此外,我们还研究了产生的湍流边界层如何分离形成剪切层。在计算成本、精度和工作量方面,将起下钻技术与先前验证的前驱方法进行了比较。采用参考实验对分离和再附着位置进行验证。瞬时流场和一、二阶统计数据表明,起下钻工况具有较强的性能。结果表明,跳闸法在精度和计算成本上都优于前驱法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Turbulent actuation of the inlet flow for a boundary layer with a mild adverse pressure gradient
In this paper, we propose an upstream tripping method for turbulence generation in large-eddy simulation of a boundary layer that separates due to an adverse pressure gradient. High-order spectral-element method is used for the numerical simulation and an arc-type trip is located near the inlet boundary of the configuration with a mild adverse pressure gradient. We investigate how the trip height, position, number as well as the inlet velocity profile affect the downstream flow characteristics. Also, we examine how the resulting turbulent boundary layer separates to form a shear layer. The tripping technique is compared with a previously validated precursor method in terms of computational cost, accuracy and effort. Validation is conducted using a reference experiment in terms of separation and reattachment locations. Instantaneous flowfield and the first- and second-order statistics demonstrate the strong performance of the tripping cases. The results suggested that the tripping method outperforms the precursor approach in both accuracy and computational cost.
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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