用于电阻开关随机存取存储器(ReRAM)的掺镧铋铁氧体薄膜的研究

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Shahnaz Kossar, Asif Rasool, Rajwali Khan, R. Amiruddin, Kulsoom Koser, Aadil Ahmad Bhat
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引用次数: 0

摘要

本研究的目的是研究镧(La)掺杂对BiFeO3 (BFO)薄膜的结构、形态、组成和元素性能的影响,并确定其在电阻开关存储器件中的应用。采用喷雾热解技术在玻璃基底上沉积La掺杂BFO薄膜,La掺杂浓度为1 ~ 8%。x射线衍射(XRD)分析表明,随着La掺杂浓度的增加,结构相由菱形向单斜/四方转变。形态学研究表明,La的掺杂显著提高了薄膜的表面光滑度。x射线光电子能谱(XPS)分析显示了氧空位(VOs)和Fe2+氧化态的存在,突出了电阻开关行为的作用。以La:BFO为中间层,研究了制备的ITO/La(x)/Al (x = 1 ~ 8%)器件结构的电阻开关特性;然而,ITO/La(5)/ al基阻性开关器件表现出增强的阻性开关特性。ITO/La(5)/Al器件的潜在电阻开关(RS)机制归因于导电丝的形成和断裂。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigations of lanthanum-doped bismuth ferrite thin films for resistive switching random access memory (ReRAM) applications

The aim of the current study is to investigate the influence of Lanthanum (La) doping on the structural, morphological, compositional, and elemental properties BiFeO3 (BFO) thin films and also to determine their application toward the resistive switching memory devices. Spray pyrolysis technique was used to deposit La-doped BFO thin films onto glass substrates and the La doping concentration was varied from 1 to 8%. X-ray diffraction (XRD) analysis revealed a structural phase transition from rhombohedral to monoclinic/tetragonal with the increase of La doping concentration. A morphological study showed that La doping significantly improved the surface smoothness of thin films. X-ray photoelectron spectroscopy (XPS) analysis shows the presence of oxygen vacancies (VOs) and Fe2+ oxidation states, highlighting the role of resistive switching behavior. Using La:BFO as an intermediate layer, the resistive switching characteristics of fabricated ITO/La(x)/Al (X = 1 to 8%) device configurations were studied; however, the ITO/La(5)/Al-based resistive switching device exhibit enhanced resistive switching characteristics. The underlying resistive switching (RS) mechanism of the ITO/La(5)/Al devices was attributed to the formation and rupture of conductive filaments.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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