功率模块集成FGM BaTiO3-Ni电容器的单步加工

IF 2.9 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Romain Raisson;Sophie Guillemet-Fritsch;Pascal Dufour;Paul-Etienne Vidal;Geoffroy Chevallier;Donatien Martineau;Cyrille Duchesne
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引用次数: 0

摘要

电力电子器件的小型化促使制造商提高元件的多功能性。获得具有异质电性能的新材料是一个挑战。在这项工作中,目标是在单步加工中制备一个陶瓷电容器,包括厚金属化。这款设备将是将其集成到电源模块中的第一步。由于金属和陶瓷材料的特性不同,组装它们是一个挑战。采用火花等离子烧结(SPS)共烧结技术制备了一种新型的BaTiO3-Ni功能梯度材料(FGM)。优化了BaTiO3-Ni FGM的工艺参数,以控制微观结构的高密度材料为目标。在这种情况下,获得了具有可控介电性能的无裂纹器件,并且可以集成到功率模块器件中。一步制造这种FGM的工艺可以用于电力电子应用中的其他组件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Single Step Processing of an Integrated FGM BaTiO3-Ni Capacitor for Power Modules’ Assembly
The miniaturization of power electronic devices is pushing manufacturers to improve the multifunctionality of components. Obtaining new materials with heterogeneous electrical properties is a challenge. In this work, the objective is to prepare, in a single step processing, a ceramic capacitor, including a thick metallization. This device will be a first step toward its integration in a power module. The assembly of a metal and ceramics is a challenge due to the difference of properties of these materials. A new BaTiO3-Ni functionally graded material (FGM) has been obtained by spark plasma sintering (SPS) co-sintering. The processing parameters of the BaTiO3-Ni FGM are optimized to target highly dense material with controlled microstructure. In this case, a crack free device is obtained with controlled dielectric properties and can be integrated in a power module device. The processing leading to the fabrication of this FGM in one step can be used for other components in power electronics applications.
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来源期刊
IEEE Transactions on Dielectrics and Electrical Insulation
IEEE Transactions on Dielectrics and Electrical Insulation 工程技术-工程:电子与电气
CiteScore
6.00
自引率
22.60%
发文量
309
审稿时长
5.2 months
期刊介绍: Topics that are concerned with dielectric phenomena and measurements, with development and characterization of gaseous, vacuum, liquid and solid electrical insulating materials and systems; and with utilization of these materials in circuits and systems under condition of use.
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