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IF 5.1 3区工程技术 Q2 ENERGY & FUELS

Thermal Science and Engineering Progress Pub Date : 2025-03-27 DOI:10.1016/j.tsep.2025.103534

Yu-qing Ji, Jing Wang, Wen-jie Shen, An Li, Zhi-peng Tan, Ji-chen Ma

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引用次数: 0

摘要

在这项工作中，开发了一种带有锯齿形发射器的离子风泵，用于大功率 LED 芯片的热控制。采用多目标优化方法确定了最佳结构。通过调整散热器的安装位置，可以有效地调节离子风的空间分布，同时还能使气流从涡流变为壁流，提高系统的热交换能力。在使用优化泵进行热管理时，系统的最大平均传热系数为 74.49 W/（K-m2）。多目标优化后，泵的功耗降低了 2.6%，芯片的外壳温度降低了 15.07%。与其他两种离子风泵相比，优化后的泵具有更好的传热系数与能耗比，最高可达 196.03 K-1-m-2。这成功地解决了冷却能力与能耗之间的争议。

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Thermal control performance and energy efficiency improvement of ionic wind pumps based on multi-parameter collaborative optimization

In this work, an ionic wind pump with saw-toothed emitters is developed for high-power LED chip thermal control. The multi-objective optimization approach is used to determine the optimal structure. The spatial ionic wind distribution may be efficiently regulated by adjusting the heat sink’s installation location, which also changes the flow from vortex to wall flow and increases the system’s heat exchange capacity. The system’s maximum mean heat transfer coefficient is 74.49 W/(K·m²) when the optimized pump is used for thermal management. The chip’s case temperature drop reaches its maximum value of 51.41 K when the chip power is greater than 9 W. After multi-objective optimization, the pump’s power consumption is reduced by 2.6 % and the chip’s case temperature is reduced by 15.07 %. The optimized pump has a better heat transfer coefficient to the energy consumption ratio, up to 196.03 K⁻¹·m⁻², in comparison to the other two reported ionic wind pumps. This successfully settles the dispute between cooling capacity and energy consumption.

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来源期刊

Thermal Science and Engineering Progress Chemical Engineering-Fluid Flow and Transfer Processes

CiteScore

7.20

自引率

10.40%

发文量

327

审稿时长

41 days

期刊介绍： Thermal Science and Engineering Progress (TSEP) publishes original, high-quality research articles that span activities ranging from fundamental scientific research and discussion of the more controversial thermodynamic theories, to developments in thermal engineering that are in many instances examples of the way scientists and engineers are addressing the challenges facing a growing population – smart cities and global warming – maximising thermodynamic efficiencies and minimising all heat losses. It is intended that these will be of current relevance and interest to industry, academia and other practitioners. It is evident that many specialised journals in thermal and, to some extent, in fluid disciplines tend to focus on topics that can be classified as fundamental in nature, or are ‘applied’ and near-market. Thermal Science and Engineering Progress will bridge the gap between these two areas, allowing authors to make an easy choice, should they or a journal editor feel that their papers are ‘out of scope’ when considering other journals. The range of topics covered by Thermal Science and Engineering Progress addresses the rapid rate of development being made in thermal transfer processes as they affect traditional fields, and important growth in the topical research areas of aerospace, thermal biological and medical systems, electronics and nano-technologies, renewable energy systems, food production (including agriculture), and the need to minimise man-made thermal impacts on climate change. Review articles on appropriate topics for TSEP are encouraged, although until TSEP is fully established, these will be limited in number. Before submitting such articles, please contact one of the Editors, or a member of the Editorial Advisory Board with an outline of your proposal and your expertise in the area of your review.