研究了烧结温度和浆料带配方,制备了具有良好介电性能的掺杂BaTi4O9陶瓷衬底

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yi Pu, Debin Lin, Daokuan Liang, Yongbao Feng, Peng Xu, Qiulong Li
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引用次数: 0

摘要

在微波电子应用中,介质陶瓷对谐振器、滤波器、衬底和波导电路的发展有着重要的影响。本研究的重点是制备nb掺杂BaTi4O9 (BT-N)介电陶瓷,特别强调了BT-N带铸基板的介电性能和力学性能。本文采用传统的固态烧结工艺制备BT-N陶瓷,并对带型铸造工艺进行了优化。精心调整滑块成分,确保绿带表面光洁度高,力学性能稳定,抗拉强度高达0.81 MPa。研究结果表明,过高的烧结温度或浸泡时间会导致Ba2Ti9O20二次相的产生,从而对材料的性能产生不利影响。烧结动力学结果表明,烧结温度为1260℃,烧结时间为2.5 h时,BT-N衬底的高密度和优越的介电特性得到了最有利的结合。采用带铸层压法制备的样品体密度为4.52 g/cm3,介电常数(εr)为40.38,介电损耗(tanδ)为8.99 × 10-4。在带状铸造工艺下,BT-N陶瓷基板的介电性能得到了显著优化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Investigating the sintering temperature and slurry tape formulation to prepare doped BaTi4O9 ceramic substrates with good dielectric properties

In microwave electronic applications, the advancement of resonators, filters, substrates, and waveguide circuits is significantly influenced by the dielectric ceramics. This research focuses on preparing Nb-doped BaTi4O9 (BT-N) dielectric ceramics, with a specific emphasis on the dielectric and mechanical properties of the BT-N tape-cast substrates. Herein, we adopted conventional solid-state sintering techniques to fabricate the BT-N ceramics and optimized the tape casting process. The slip composition was meticulously adjusted to ensure the green tapes with a smooth surface finish and robust mechanical properties, which shows high tensile strength of 0.81 MPa. The investigation results demonstrate that excessive sintering temperatures or soaking times lead to the emergence of the Ba2Ti9O20 secondary phase, thereby adversely impacting the material’s properties. The sintering kinetics of the BT-N substrates result demonstrates that the sintering temperature of 1260 °C for a duration of 2.5 h resulted in the most favorable combination of high density and superior dielectric characteristics. The sample using tape casting lamination process exhibits a high bulk density of 4.52 g/cm3, accompanied by a dielectric constant (εr) of 40.38 and dielectric loss (tanδ) of 8.99 × 10–4. Under the tape casting processing, the dielectric properties of the BT-N ceramic substrates are significantly optimized.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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