Yang He, Feng Zhou, Yingxi Zhang, Tuan Lv, Paul K. Chu, Kaifu Huo
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引用次数: 0
摘要
硅(Si)是下一代锂离子电池(LIBs)极具前景的负极材料,但硅颗粒体积的巨大变化会导致负极断裂和电流收集器的分层,从而阻碍了实际应用。本文通过聚丙烯酸(PAA)和交联聚氨酯(CPU)的共价键和氢键,制备了一种高韧性、分层应力消散的硅阳极粘合剂。物理化学双交联CPU-PAA粘合剂具有高韧性、大拉伸强度和分层应力耗散,提高了Si阳极的结构完整性,最大限度地减少了厚度膨胀。有限元分析证实,CPU-PAA粘结剂减少并均匀了循环过程中Si阳极内的应力分布。结果表明,在5 a g-1的高电流密度下,Si/CPU-PAA阳极在150次循环后的容量保持率高达82.3%。此外,Si/CPU-PAA//LiNi0.5Co0.2Mn0.3O2全电池具有稳定的循环性能,突出了CPU-PAA粘结剂在高能量密度锂离子电池中的巨大潜力。这项工作为高性能硅阳极的高强度、大韧性和高效应力消散粘合剂的设计提供了见解。
High-Toughness and Hierarchical Stress-Dissipating Binder Based on Physicochemical Dual-Cross-Linking for High-Performance Silicon Anodes
Silicon (Si) is a promising anode material for next-generation lithium-ion batteries (LIBs), but the huge volume change of Si particles causes anode fracture and delamination from the current collector, thereby stifling practical implementation. Herein, a high-toughness and hierarchical stress-dissipating binder for Si anodes is prepared by the covalent and hydrogen bonding of poly(acrylic acid) (PAA) and a cross-linked polyurethane (CPU). The physicochemical dual-cross-linked CPU-PAA binder with high toughness, large tensile strength, and hierarchical stress dissipation improves the structural integrity of Si anodes and minimizes thickness swelling. Finite element analysis confirms that the CPU-PAA binder reduces and uniformizes the stress distribution within the Si anodes during cycling. As a result, the Si/CPU-PAA anode shows a high capacity retention of 82.3% after 150 cycles at a high current density of 5 A g–1. Moreover, the Si/CPU-PAA//LiNi0.5Co0.2Mn0.3O2 full cell delivers stable cycling performance, highlighting the great potential of the CPU-PAA binder in high-energy-density LIBs. This work provides insights into the design of high-strength, large-toughness, and efficient stress-dissipating binders for high-performance Si anodes.
期刊介绍:
ACS Applied Materials & Interfaces is a leading interdisciplinary journal that brings together chemists, engineers, physicists, and biologists to explore the development and utilization of newly-discovered materials and interfacial processes for specific applications. Our journal has experienced remarkable growth since its establishment in 2009, both in terms of the number of articles published and the impact of the research showcased. We are proud to foster a truly global community, with the majority of published articles originating from outside the United States, reflecting the rapid growth of applied research worldwide.