用于无线应用的超柔性石墨烯金属纳米膜

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Jiejun Zhang, Haitao Jiang, Weida Hong, Qing Meng, Zhongying Xue, Miao Zhang, Paul K. Chu, Yongfeng Mei, Ziao Tian, Zengfeng Di
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引用次数: 0

摘要

无线通信的进步提高了对可穿戴电子产品和柔性通信设备的灵活、高性能射频天线的需求。传统的方法侧重于减少金属薄膜的厚度,以提高灵活性,但由于趋肤效应而受到限制。本文采用一步分层工艺制备了一种石墨烯-金混合纳米膜,以解决传统金属膜的局限性,包括灵活性和射频功能。石墨烯-金纳米膜具有无键范德华界面,允许金层随石墨烯自由移动。这种结构减轻了裂纹的形成,提高了14%以上的拉伸性和抗疲劳性。此外,这种复合材料克服了与蒙皮深度相关的限制,从而使超薄石墨烯-金天线能够在8.5 GHz下工作,用于5g通信。我们还演示了无线图像传输和电磁隐身。研究结果强调了创新设计和材料对柔性无线技术的重大影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Ultra-flexible graphene-metal nanomembrane for wireless applications

Ultra-flexible graphene-metal nanomembrane for wireless applications

The advancement of wireless communication raises the demand for flexible, high-performance RF antennas for wearable electronics and flexible communication devices. Traditional approaches focused on reducing the thickness of metal films to enhance flexibility which faces limitations due to the skin effect. Herein, a hybrid graphene-Au nanomembrane is produced by one-step delamination processes to address the limitations of traditional metal films, including flexibility and RF functionality. The graphene-Au nanomembrane features a bond-free van der Waals interface, allowing the Au layer move freely with graphene. This structure mitigates the formation of cracks, enhancing the stretchability to over 14% strain and fatigue resistance. Moreover, this composite overcomes the limitations associated with skin depth, consequently enabling an ultra-thin graphene-Au antenna operating at 8.5 GHz for 5 G communications. We also demonstrate wireless image transmission and electromagnetic stealth. The results underscore the significant impact of the innovative design and materials on flexible wireless technology.

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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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