通过高压热扩散获得高电离效率的掺磷n型金刚石

IF 6.8 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Ruiang Guo  (, ), Shuaiqi Li  (, ), Jiawei Zhang  (, ), Yi Tian  (, ), Weiguo Dong  (, ), Duanwei He  (, )
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引用次数: 0

摘要

金刚石因其优异的物理性能被称为“终极半导体”。然而,n型掺杂难度高和n型金刚石电性能差仍然是金刚石半导体材料应用的主要挑战。本文首次报道了一种利用高压减小磷原子与碳原子体积差的金刚石n型掺杂高压热扩散方法。该方法可以实现磷原子在金刚石晶格位置的高效掺杂和电离。所制备的磷掺杂金刚石在室温(300 K)下表现出了已知的磷掺杂金刚石单晶中最低的电阻率(2 Ω cm)和最高的电子浓度(2.27 × 1018 cm−3)。高压热扩散方法为金刚石n型掺杂提供了一种有效的途径,这将在未来金刚石基半导体器件的设计和制备中发挥重要作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Phosphorus-doped n-type diamond with high ionization efficiency through high-pressure thermal diffusion

Diamond is known as the ultimate semiconductor owing to its excellent physical properties. However, the high difficulty of n-type doping and the poor electrical performance of n-type diamonds remain major challenges for the application of diamond semiconductor materials. In this paper, a high-pressure thermal diffusion method for the n-type doping of diamond, which utilizes high pressure to reduce the volume difference between phosphorus atoms and carbon atoms, is reported for the first time. This method can achieve efficient doping and ionization of phosphorus atoms at the lattice sites of diamond. The prepared phosphorus-doped diamond exhibited the lowest resistivity (2 Ω cm) and highest electron concentration (2.27 × 1018 cm−3) observed in any known phosphorus-doped diamond single crystal at room temperature (300 K). The high-pressure thermal diffusion method provides an effective approach for diamond n-type doping, which may play an important role in the design and preparation of future diamond-based semiconductor devices.

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来源期刊
Science China Materials
Science China Materials Materials Science-General Materials Science
CiteScore
11.40
自引率
7.40%
发文量
949
期刊介绍: Science China Materials (SCM) is a globally peer-reviewed journal that covers all facets of materials science. It is supervised by the Chinese Academy of Sciences and co-sponsored by the Chinese Academy of Sciences and the National Natural Science Foundation of China. The journal is jointly published monthly in both printed and electronic forms by Science China Press and Springer. The aim of SCM is to encourage communication of high-quality, innovative research results at the cutting-edge interface of materials science with chemistry, physics, biology, and engineering. It focuses on breakthroughs from around the world and aims to become a world-leading academic journal for materials science.
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