先进的玻璃聚合物与螺吡喃珠:多响应,形状记忆,自我修复和可再处理的智能材料(小12/2025)

IF 12.1 2区 材料科学 Q1 CHEMISTRY, MULTIDISCIPLINARY
Small Pub Date : 2025-03-26 DOI:10.1002/smll.202570095
Seunghyeon Song, Han Gyeol Jang, Jae Hoon Lee, Yong Chae Jung, Doh C. Lee, Sung-Kon Kim, Jaewoo Kim, Yong-Seok Choi
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引用次数: 0

摘要

智能材料环氧玻璃体,基于动态共价键,提供了传统热固性材料的可回收替代品。在2407022号文章中,Sung-Kon Kim, Jaewoo Kim, Yong-Seok Choi及其同事使用环氧丙烷螺吡喃珠开发了一种自我修复和机械反应的玻璃聚合物,可以通过颜色或荧光变化实现裂缝自我报告。该玻璃体有效地表现出额外的性能,包括形状记忆、可重构性和可再加工性。其智能特性适用于传感器、执行器、4D打印和安全诊断等应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Advanced Vitrimer with Spiropyran Beads: A Multi-Responsive, Shape Memory, Self-Healing, and Reprocessable Smart Material (Small 12/2025)

Advanced Vitrimer with Spiropyran Beads: A Multi-Responsive, Shape Memory, Self-Healing, and Reprocessable Smart Material (Small 12/2025)

Smart Materials

Epoxy vitrimers, based on dynamic covalent bonds, offer a recyclable alternative to traditional thermosets. In article number 2407022, Sung-Kon Kim, Jaewoo Kim, Yong-Seok Choi, and co-workers develop a self-healing and mechano-responsive vitrimer using epoxide spiropyran beads, enabling crack self-reporting via color or fluorescent changes. The vitrimer effectively exhibits additional properties, including shape memory, reconfiguration and reprocessability. Its smart properties suit applications like sensors, actuators, 4D printing, and safety diagnostics.

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来源期刊
Small
Small 工程技术-材料科学:综合
CiteScore
17.70
自引率
3.80%
发文量
1830
审稿时长
2.1 months
期刊介绍: Small serves as an exceptional platform for both experimental and theoretical studies in fundamental and applied interdisciplinary research at the nano- and microscale. The journal offers a compelling mix of peer-reviewed Research Articles, Reviews, Perspectives, and Comments. With a remarkable 2022 Journal Impact Factor of 13.3 (Journal Citation Reports from Clarivate Analytics, 2023), Small remains among the top multidisciplinary journals, covering a wide range of topics at the interface of materials science, chemistry, physics, engineering, medicine, and biology. Small's readership includes biochemists, biologists, biomedical scientists, chemists, engineers, information technologists, materials scientists, physicists, and theoreticians alike.
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