基于基片集成波导与槽线相结合的模式复合结构双带滤波器的设计

IF 1.9 3区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Microelectronics Journal Pub Date : 2025-03-19 DOI:10.1016/j.mejo.2025.106650

Yuhao Yang , Yongle Wu , Weimin Wang , Shiyu Xie , Yuanan Liu

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引用次数: 0

摘要

本文提出了一种结合衬底集成波导（SIWs）和槽线的新型模式复合结构，为微波和毫米波双带滤波器提供了一种紧凑的解决方案。槽线的TEM模式和单基片层内SIWs的TE模式同时传输。它们可以共享端口、馈电电路和馈电孔径，这意味着所提出的结构紧凑，提供有效的集成。特别是，嵌入的槽线能够与馈电电路产生低频共振，并且能够调节高频段TE模式的场分布。通过仿真和测量验证了该滤波器的性能，带宽范围为15.49 GHz ~ 17.42 GHz和33.05 GHz ~ 35.10 GHz，带外抑制性能优于20.24 dB。它适用于Ku和Ka应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design of a dual-band filter based on mode composite structure combining substrate integrated waveguides and slotlines

This paper proposes a novel mode composite structure that combines substrate integrated waveguides (SIWs) and slotlines, offering a compact solution for a dual-band filter targeting both microwave and millimeter-wave bands. The TEM mode of slotlines and TE modes of SIWs within a single substrate layer are transmitted simultaneously. They can share ports, feeding circuits and feeding apertures, which means the proposed structure is compact, offering efficient integration. Particularly, slotlines embedded are capable of generating low-frequency resonances with feeding circuits, and are able to regulate the field distributions of TE modes in high bands. The performance of the filter is validated through simulation and measurement, demonstrating bandwidths from 15.49 GHz to 17.42 GHz and from 33.05 GHz to 35.10 GHz, with excellent out-of-band rejection more than 20.24 dB. It is suitable for Ku and Ka applications.

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来源期刊

Microelectronics Journal 工程技术-工程：电子与电气

CiteScore

4.00

自引率

27.30%

发文量

222

审稿时长

43 days

期刊介绍： Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.