{"title":"中空二氧化硅纳米粒子壳结构对聚酰亚胺复合薄膜介电性能的影响","authors":"Quanyue Wen, Kento Ishii, Fumiya Tanahashi, Masayoshi Fuji","doi":"10.1016/j.apt.2025.104854","DOIUrl":null,"url":null,"abstract":"<div><div>A hollow silica nanoparticle (HSNP)/polyimide (PI) composite is expected to be applied to a low dielectric constant material for semiconductors. The effect of the shell structure of the HSNP on the HSNP/PI composite’s dielectric properties was investigated. The results indicated that the dielectric constant and dielectric loss of HNSP/PI composite film can be lowered by reducing the HSNP shell thickness (increase the air proportion) or decreasing the HSNP density (reduce the dipole polarization in electric field). When the shell thickness of HNSP decreases from 37.94 nm to 13.81 nm, the shell density decreases from 1.95 g/cm<sup>3</sup> to 1.75 g/cm<sup>3</sup>, the HSNP content increases from 0 vol% to 20 vol%, the HSNP/PI composite film dielectric constant reduces from 4.42 to 3.85(at 1 MHz). The effect of the hollow particles’ shell configuration on the composite’s dielectric properties was also clarified. These findings can help to promote the further application of hollow particles in low-dielectric materials.</div></div>","PeriodicalId":7232,"journal":{"name":"Advanced Powder Technology","volume":"36 5","pages":"Article 104854"},"PeriodicalIF":4.2000,"publicationDate":"2025-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The effect of hollow silica nanoparticle shell structure on the dielectric properties of polyimide composite films\",\"authors\":\"Quanyue Wen, Kento Ishii, Fumiya Tanahashi, Masayoshi Fuji\",\"doi\":\"10.1016/j.apt.2025.104854\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>A hollow silica nanoparticle (HSNP)/polyimide (PI) composite is expected to be applied to a low dielectric constant material for semiconductors. The effect of the shell structure of the HSNP on the HSNP/PI composite’s dielectric properties was investigated. The results indicated that the dielectric constant and dielectric loss of HNSP/PI composite film can be lowered by reducing the HSNP shell thickness (increase the air proportion) or decreasing the HSNP density (reduce the dipole polarization in electric field). When the shell thickness of HNSP decreases from 37.94 nm to 13.81 nm, the shell density decreases from 1.95 g/cm<sup>3</sup> to 1.75 g/cm<sup>3</sup>, the HSNP content increases from 0 vol% to 20 vol%, the HSNP/PI composite film dielectric constant reduces from 4.42 to 3.85(at 1 MHz). The effect of the hollow particles’ shell configuration on the composite’s dielectric properties was also clarified. These findings can help to promote the further application of hollow particles in low-dielectric materials.</div></div>\",\"PeriodicalId\":7232,\"journal\":{\"name\":\"Advanced Powder Technology\",\"volume\":\"36 5\",\"pages\":\"Article 104854\"},\"PeriodicalIF\":4.2000,\"publicationDate\":\"2025-03-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advanced Powder Technology\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0921883125000755\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, CHEMICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Powder Technology","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0921883125000755","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
The effect of hollow silica nanoparticle shell structure on the dielectric properties of polyimide composite films
A hollow silica nanoparticle (HSNP)/polyimide (PI) composite is expected to be applied to a low dielectric constant material for semiconductors. The effect of the shell structure of the HSNP on the HSNP/PI composite’s dielectric properties was investigated. The results indicated that the dielectric constant and dielectric loss of HNSP/PI composite film can be lowered by reducing the HSNP shell thickness (increase the air proportion) or decreasing the HSNP density (reduce the dipole polarization in electric field). When the shell thickness of HNSP decreases from 37.94 nm to 13.81 nm, the shell density decreases from 1.95 g/cm3 to 1.75 g/cm3, the HSNP content increases from 0 vol% to 20 vol%, the HSNP/PI composite film dielectric constant reduces from 4.42 to 3.85(at 1 MHz). The effect of the hollow particles’ shell configuration on the composite’s dielectric properties was also clarified. These findings can help to promote the further application of hollow particles in low-dielectric materials.
期刊介绍:
The aim of Advanced Powder Technology is to meet the demand for an international journal that integrates all aspects of science and technology research on powder and particulate materials. The journal fulfills this purpose by publishing original research papers, rapid communications, reviews, and translated articles by prominent researchers worldwide.
The editorial work of Advanced Powder Technology, which was founded as the International Journal of the Society of Powder Technology, Japan, is now shared by distinguished board members, who operate in a unique framework designed to respond to the increasing global demand for articles on not only powder and particles, but also on various materials produced from them.
Advanced Powder Technology covers various areas, but a discussion of powder and particles is required in articles. Topics include: Production of powder and particulate materials in gases and liquids(nanoparticles, fine ceramics, pharmaceuticals, novel functional materials, etc.); Aerosol and colloidal processing; Powder and particle characterization; Dynamics and phenomena; Calculation and simulation (CFD, DEM, Monte Carlo method, population balance, etc.); Measurement and control of powder processes; Particle modification; Comminution; Powder handling and operations (storage, transport, granulation, separation, fluidization, etc.)