Dániel Straubinger, Peter Koltay, Roland Zengerle, Sabrina Kartmann, Zhe Shu
{"title":"用于热敏3D电子产品和智能可穿戴设备的熔融金属打印多功能选择性焊接","authors":"Dániel Straubinger, Peter Koltay, Roland Zengerle, Sabrina Kartmann, Zhe Shu","doi":"10.1002/adfm.202419653","DOIUrl":null,"url":null,"abstract":"<p>A novel and versatile soldering method is presented using non-contact direct printing of molten metal for 3D electronics, printed electronics, and smart wearables. The solder joints can be created selectively by the StarJet technology in a non-contact manner at room temperature on substrates with 3D topology. The interconnections exhibit minimal void content and a microstructure comparable to traditional solder joints, indicating high electrical and thermal conductivity. They show a robust shear strength (≈30 N with 0805 SMDs on a 3D-printed polymer substrate). The approach enables the soldering of sensors, microchips, and electronic components on standard PCBs as well as heat-sensitive substrates, offering a sustainable alternative to industry-standard conductive adhesives. Electronic components are selectively soldered onto a biodegradable polymer (PLA), a heat-sensitive textile (polyester), and hybrid 3D-printed flexible circuits to highlight the versatility of the molten metal selective soldering technology.</p>","PeriodicalId":112,"journal":{"name":"Advanced Functional Materials","volume":"35 33","pages":""},"PeriodicalIF":19.0000,"publicationDate":"2025-03-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://advanced.onlinelibrary.wiley.com/doi/epdf/10.1002/adfm.202419653","citationCount":"0","resultStr":"{\"title\":\"Versatile Selective Soldering via Molten Metal Printing for Heat-Sensitive 3D Electronics and Smart Wearables\",\"authors\":\"Dániel Straubinger, Peter Koltay, Roland Zengerle, Sabrina Kartmann, Zhe Shu\",\"doi\":\"10.1002/adfm.202419653\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p>A novel and versatile soldering method is presented using non-contact direct printing of molten metal for 3D electronics, printed electronics, and smart wearables. The solder joints can be created selectively by the StarJet technology in a non-contact manner at room temperature on substrates with 3D topology. The interconnections exhibit minimal void content and a microstructure comparable to traditional solder joints, indicating high electrical and thermal conductivity. They show a robust shear strength (≈30 N with 0805 SMDs on a 3D-printed polymer substrate). The approach enables the soldering of sensors, microchips, and electronic components on standard PCBs as well as heat-sensitive substrates, offering a sustainable alternative to industry-standard conductive adhesives. Electronic components are selectively soldered onto a biodegradable polymer (PLA), a heat-sensitive textile (polyester), and hybrid 3D-printed flexible circuits to highlight the versatility of the molten metal selective soldering technology.</p>\",\"PeriodicalId\":112,\"journal\":{\"name\":\"Advanced Functional Materials\",\"volume\":\"35 33\",\"pages\":\"\"},\"PeriodicalIF\":19.0000,\"publicationDate\":\"2025-03-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://advanced.onlinelibrary.wiley.com/doi/epdf/10.1002/adfm.202419653\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Advanced Functional Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://advanced.onlinelibrary.wiley.com/doi/10.1002/adfm.202419653\",\"RegionNum\":1,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"CHEMISTRY, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Functional Materials","FirstCategoryId":"88","ListUrlMain":"https://advanced.onlinelibrary.wiley.com/doi/10.1002/adfm.202419653","RegionNum":1,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
Versatile Selective Soldering via Molten Metal Printing for Heat-Sensitive 3D Electronics and Smart Wearables
A novel and versatile soldering method is presented using non-contact direct printing of molten metal for 3D electronics, printed electronics, and smart wearables. The solder joints can be created selectively by the StarJet technology in a non-contact manner at room temperature on substrates with 3D topology. The interconnections exhibit minimal void content and a microstructure comparable to traditional solder joints, indicating high electrical and thermal conductivity. They show a robust shear strength (≈30 N with 0805 SMDs on a 3D-printed polymer substrate). The approach enables the soldering of sensors, microchips, and electronic components on standard PCBs as well as heat-sensitive substrates, offering a sustainable alternative to industry-standard conductive adhesives. Electronic components are selectively soldered onto a biodegradable polymer (PLA), a heat-sensitive textile (polyester), and hybrid 3D-printed flexible circuits to highlight the versatility of the molten metal selective soldering technology.
期刊介绍:
Firmly established as a top-tier materials science journal, Advanced Functional Materials reports breakthrough research in all aspects of materials science, including nanotechnology, chemistry, physics, and biology every week.
Advanced Functional Materials is known for its rapid and fair peer review, quality content, and high impact, making it the first choice of the international materials science community.