22nm FD-SOI CMOS工艺单端/差分宽带跟踪保持放大器

IF 2.8 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Zixian Zheng;Wei Shu;Joseph S. Chang
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引用次数: 0

摘要

即将到来的基于软件定义无线电(SDR)的6G通信需要射频(RF)跟踪保持放大器(THA)。该THA作为频率下变频器和到下游模数转换器(ADC)的单差分接口。我们提出了一种CMOS RF THA,其特点是宽和宽(18 GHz),但线性度高(无杂散动态范围(SFDR)为56.7 dB),不需要外部平衡。这些特征来源于我们提出的基于双源从动器增强(DSFE)结构的隔离技术。为了在没有外部平衡器的情况下实现单差转换,我们设计了一个独立的平衡器作为第一级。之后,我们采用我们提出的前馈补偿技术(FCT)以及报道的相位校正技术(PCT)来减少输出不匹配,同时提高线性度和带宽。我们在工作电压为1.8 V的22nm全耗尽绝缘体上硅(FD-SOI) CMOS中实现了RF THA。测量表明,输入带宽很宽(18 GHz),但具有高线性度(15 GHz时SFDR =56.7 dB),采样率为2 GS/s。功耗低,芯片面积小,分别为216 mW和0.07 mm2。当与已报道的III/V RF THA进行基准测试时,所提出的CMOS RF THA具有非常强的竞争力-相当的带宽,同时具有更高的线性度,潜在的更低成本,更低的功耗和更小的芯片面积。此外,由于它是在CMOS中实现的,因此它易于集成到同一片上系统(SoC)中的其他CMOS电路中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Single-Ended/Differential Wideband Track-and-Hold Amplifier in 22-nm FD-SOI CMOS Process
The impending 6G communication based on the software defined radio (SDR) requires a radio frequency (RF) track-and-hold amplifier (THA). This THA serves as the frequency down-converter and the single-to-differential interface to the downstream analog-to-digital converter (ADC). We present a CMOS RF THA that features wide and width (18 GHz), yet high linearity (spurious free dynamic range (SFDR) of 56.7 dB) and not requiring an external balun. These features are derived from our proposed isolation technique based on our proposed double source follower enhanced (DSFE) structure. To realize the single-to-differential conversion without an external balun, we design an independent balun as the first stage. Thereafter, we employ our proposed feedforward compensation technique (FCT) along with the reported phase correction technique (PCT) to reduce the output mismatches while simultaneously enhancing the linearity and bandwidth. We monolithically realize the RF THA in 22-nm fully-depleted silicon-on-insulator (FD-SOI) CMOS operating at 1.8 V. Measurements depict that the input bandwidth is wide (18 GHz), yet featuring high linearity (SFDR =56.7 dB at 15 GHz) with 2 GS/s sampling rate. The power consumption and the chip area are low and small at 216 mW and 0.07 mm2, respectively. When benchmarked against reported III/V RF THAs, the proposed CMOS RF THA is very competitive—comparable bandwidth, yet simultaneously higher linearity, potentially lower cost, lower power dissipation, and smaller die area. Further because it is realized in CMOS, it facilitates integration to other CMOS circuits in the same system-on-chip (SoC).
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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