用简单的热退火处理修复拉伸BN/UHMWPE复合材料中的填料-基体界面

Xiangyan Yu, Qichen Zhou, Xiaoxiao Yu, Man Zhang, Coskun Kocabas, Han Zhang, Dimitrios G. Papageorgiou, Haixue Yan, Michael John Reece and Emiliano Bilotti
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引用次数: 0

摘要

导热聚合物电介质能有效地散热,从而降低工作温度,在现代电子系统中具有很大的应用潜力。本研究采用非功能化氮化硼微片(BN)和由固态拉伸诱导的大分子取向来提高超高分子量聚乙烯(UHMWPE)的导热性。然后利用热退火处理来修复在拉伸过程中产生的填料-基质界面缺陷,以提高介电性能。当拉伸比为20时,退火后的UHMWPE/1 wt% BN复合薄膜击穿强度提高20%,充放电效率略有提高,达到94%。这一发现证明了一种简单快速的方法来优化聚合物复合材料薄膜的介电和导热性能,而不需要任何填料表面功能化,这有望扩大聚合物薄膜电容器的适用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Healing filler–matrix interfaces in drawn BN/UHMWPE composites by a simple thermal annealing treatment†

Healing filler–matrix interfaces in drawn BN/UHMWPE composites by a simple thermal annealing treatment†

Thermally conductive polymer dielectrics have great potential in modern electronic systems by efficiently dissipating the generated heat and thus decreasing the working temperature. Here, unfunctionalised boron nitride microplatelets (BN) and macromolecular alignment, induced by solid-state drawing, were adopted to increase the thermal conductivity of ultra-high-molecular-weight-polyethylene (UHMWPE). A thermal annealing treatment was then utilised to heal filler–matrix interface defects, created during drawing, to enhance the dielectric properties. In particular, an annealed UHMWPE/1 wt% BN composite film with a draw ratio of 20 showed a 20% increase in breakdown strength and a slight increase in charge–discharge efficiency to 94%. This finding demonstrates a simple and fast method to optimize the dielectric and thermal conduction properties of polymer composites films, without the need of any filler surface functionalisation, which promises widening applicability of polymer film capacitors.

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