探索从3d打印到4d打印的转变:综述

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Sandeep Kumar Sood;Yogveer Singh Lamba;Ashutosh Kumar Singh
{"title":"探索从3d打印到4d打印的转变:综述","authors":"Sandeep Kumar Sood;Yogveer Singh Lamba;Ashutosh Kumar Singh","doi":"10.1109/JSEN.2025.3529135","DOIUrl":null,"url":null,"abstract":"The advent of 3-D printing has revolutionized industries, while 4-D printing introduces dynamic shape changes over time, driven by materials programmed to respond to stimuli autonomously. This advancement represents a significant leap in additive manufacturing, with wide-ranging implications across various fields. Consequently, this study serves as a comprehensive resource for readers aiming to understand the current state of 3-D and 4-D printing technologies. It seeks to elucidate research patterns and recent trends through an analysis of a dataset obtained from the Scopus database. The scientometric analysis yields valuable insights into the geographical distribution of authors, publication trends, country collaborations, and cocitation networks. These analyses identify the most prolific researchers, track temporal developments, highlight leading collaborative nations, and delineate prominent research trends within this domain. The results indicate that emerging research areas include “shape memory polymer (SMP),” “continuous fiber,” “freeform surface,” “self-healing hydrogel,” and multimaterial and eco-friendly materials advancements are emerging research areas. Furthermore, we conducted a systematic literature review to extract critical insights, identify research challenges, and propose future research directions within this dynamic field.","PeriodicalId":447,"journal":{"name":"IEEE Sensors Journal","volume":"25 6","pages":"9224-9232"},"PeriodicalIF":4.3000,"publicationDate":"2025-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Exploring the Shift From 3-D Printing to 4-D Printing: A Review\",\"authors\":\"Sandeep Kumar Sood;Yogveer Singh Lamba;Ashutosh Kumar Singh\",\"doi\":\"10.1109/JSEN.2025.3529135\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The advent of 3-D printing has revolutionized industries, while 4-D printing introduces dynamic shape changes over time, driven by materials programmed to respond to stimuli autonomously. This advancement represents a significant leap in additive manufacturing, with wide-ranging implications across various fields. Consequently, this study serves as a comprehensive resource for readers aiming to understand the current state of 3-D and 4-D printing technologies. It seeks to elucidate research patterns and recent trends through an analysis of a dataset obtained from the Scopus database. The scientometric analysis yields valuable insights into the geographical distribution of authors, publication trends, country collaborations, and cocitation networks. These analyses identify the most prolific researchers, track temporal developments, highlight leading collaborative nations, and delineate prominent research trends within this domain. The results indicate that emerging research areas include “shape memory polymer (SMP),” “continuous fiber,” “freeform surface,” “self-healing hydrogel,” and multimaterial and eco-friendly materials advancements are emerging research areas. Furthermore, we conducted a systematic literature review to extract critical insights, identify research challenges, and propose future research directions within this dynamic field.\",\"PeriodicalId\":447,\"journal\":{\"name\":\"IEEE Sensors Journal\",\"volume\":\"25 6\",\"pages\":\"9224-9232\"},\"PeriodicalIF\":4.3000,\"publicationDate\":\"2025-01-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Sensors Journal\",\"FirstCategoryId\":\"103\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10858645/\",\"RegionNum\":2,\"RegionCategory\":\"综合性期刊\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Sensors Journal","FirstCategoryId":"103","ListUrlMain":"https://ieeexplore.ieee.org/document/10858645/","RegionNum":2,"RegionCategory":"综合性期刊","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

3d打印的出现彻底改变了工业,而4d打印则引入了动态的形状变化,随着时间的推移,由编程的材料自动响应刺激驱动。这一进步代表了增材制造的重大飞跃,在各个领域都有广泛的影响。因此,本研究为旨在了解3d和4d打印技术现状的读者提供了一个全面的资源。它试图通过对从Scopus数据库获得的数据集的分析来阐明研究模式和最近的趋势。科学计量学分析对作者的地理分布、出版趋势、国家合作和协作网络产生了有价值的见解。这些分析确定了最多产的研究人员,跟踪了时间发展,突出了主要的合作国家,并描绘了该领域的突出研究趋势。结果表明,“形状记忆聚合物(SMP)”、“连续纤维”、“自由曲面”、“自愈水凝胶”等新兴研究领域,多材料和环保材料的进步是新兴研究领域。此外,我们进行了系统的文献综述,以提取关键见解,确定研究挑战,并提出未来在这个动态领域的研究方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Exploring the Shift From 3-D Printing to 4-D Printing: A Review
The advent of 3-D printing has revolutionized industries, while 4-D printing introduces dynamic shape changes over time, driven by materials programmed to respond to stimuli autonomously. This advancement represents a significant leap in additive manufacturing, with wide-ranging implications across various fields. Consequently, this study serves as a comprehensive resource for readers aiming to understand the current state of 3-D and 4-D printing technologies. It seeks to elucidate research patterns and recent trends through an analysis of a dataset obtained from the Scopus database. The scientometric analysis yields valuable insights into the geographical distribution of authors, publication trends, country collaborations, and cocitation networks. These analyses identify the most prolific researchers, track temporal developments, highlight leading collaborative nations, and delineate prominent research trends within this domain. The results indicate that emerging research areas include “shape memory polymer (SMP),” “continuous fiber,” “freeform surface,” “self-healing hydrogel,” and multimaterial and eco-friendly materials advancements are emerging research areas. Furthermore, we conducted a systematic literature review to extract critical insights, identify research challenges, and propose future research directions within this dynamic field.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信