柔性超级电容器用多功能耐低温双网络有机凝胶

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jiuzhi Wei, Yuehua Liang, Juan Zhang, Yanyan Li, Caiyuan Guo, Tingting Zhang, Haizhen Yuan, Enke Feng, Xinxian Ma, Xinning Han
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引用次数: 0

摘要

以聚乙烯醇(PVA)、山梨醇(S)和聚吡咯(PPy)为原料制备了PVA/S/PPy有机凝胶。该有机凝胶具有优异的拉伸性能,伸长率高达716%,最大拉伸强度为1682 kPa,可轻松提起1700 g的反应釜。它还具有出色的附着力;它可以粘附在各种疏水性和亲水性基材以及皮肤表面,并可以被智能手机屏幕识别为触控笔。采用PVA/S/PPy制备的柔性超级电容器具有较高的离子电导率(22.7 mS cm−1)、优良的比电容(107 F g−1)和良好的循环稳定性,循环1000次后电容保持率达到84.1%。此外,即使在- 20°C下,它也能保持优越的比电容保持率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Multi-functional low-temperature-resistant dual-network organogels for flexible supercapacitors

The PVA/S/PPy organogel has been prepared from Polyvinyl alcohol (PVA), sorbitol (S) and polypyrrole (PPy) as raw material. This organogel exhibits excellent tensile properties, with an elongation rate of up to 716% and a maximum tensile strength of 1682 kPa, allowing it to easily lift a 1700 g reaction kettle. It also shows outstanding adhesion; it can adhere to various hydrophobic and hydrophilic substrates as well as skin surfaces and can be recognised by a smartphone screen as a stylus. A flexible supercapacitor prepared using PVA/S/PPy demonstrates high ionic conductivity (22.7 mS cm−1), excellent specific capacitance (107 F g−1), and outstanding cycling stability, reaching a capacitance retention rate of 84.1% after 1000 cycles. Moreover, it maintains a superior specific capacitance retention rate even at − 20 °C.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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