{"title":"片上光谱成像和传感技术向市场化技术过渡","authors":"Kaiyu Cui, Yidong Huang","doi":"10.1038/s44287-025-00148-8","DOIUrl":null,"url":null,"abstract":"The shift from lab research to real-world production of scientific innovations comes with challenges. For spectral imaging chips, we address practical application needs by identifying real problems, solving them efficiently and delivering functional solutions. This has enabled a substantial transition from academic research to market-ready products.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"2 3","pages":"151-152"},"PeriodicalIF":0.0000,"publicationDate":"2025-02-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"On-chip spectral imaging and sensing transition towards marketable technologies\",\"authors\":\"Kaiyu Cui, Yidong Huang\",\"doi\":\"10.1038/s44287-025-00148-8\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The shift from lab research to real-world production of scientific innovations comes with challenges. For spectral imaging chips, we address practical application needs by identifying real problems, solving them efficiently and delivering functional solutions. This has enabled a substantial transition from academic research to market-ready products.\",\"PeriodicalId\":501701,\"journal\":{\"name\":\"Nature Reviews Electrical Engineering\",\"volume\":\"2 3\",\"pages\":\"151-152\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2025-02-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nature Reviews Electrical Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.nature.com/articles/s44287-025-00148-8\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nature Reviews Electrical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.nature.com/articles/s44287-025-00148-8","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
On-chip spectral imaging and sensing transition towards marketable technologies
The shift from lab research to real-world production of scientific innovations comes with challenges. For spectral imaging chips, we address practical application needs by identifying real problems, solving them efficiently and delivering functional solutions. This has enabled a substantial transition from academic research to market-ready products.
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