{"title":"半导体介质中的热弹性和电磁效应","authors":"N. Islam, B. Das, G. C. Shit, A. Lahiri","doi":"10.1007/s00707-025-04267-z","DOIUrl":null,"url":null,"abstract":"<div><p>This paper addresses the generalized electromagnetothermoelastic problem for a homogeneous and isotropic thin circular semiconductor. We consider the non-local heat conduction equation due to the miniaturization of modern electronic devices and the prevalent use of ultrashort lasers in environments with extremely high-temperature gradients, along with the presence of a primary electromagnetic field. We assume that while heat propagation exhibits non-local properties, deformation behaves locally. The curved surface of the semiconductor is subjected to an exponentially time-dependent thermal and mechanical load. We employ a finite difference method utilizing the Crank–Nicolson implicit scheme to solve the governing coupled linear equations of hyperbolic type for extremely short-time actions and small microstructured sizes. Our study investigates the impact of the chemical concentration and the physical field variables of the diffusive material to predict the thermoelastic behavior within the nanostructured semiconducting medium. We present numerical computations of the chemical concentration, temperature distribution, chemical potential, deformation, and stress components for fixed values of physical parameters. The results indicate that the non-local parameter significantly smooths out sudden changes in thermal and stress gradients. The phase-lag parameters associated with heat flux and temperature gradient both have finite-speed thermal wave propagation and account for thermal inertia effects. These mechanisms collectively contribute to a reduction in surface resistance. Such factors are essential for precisely capturing ultrashort thermoelastic responses under rapid thermal loading, enabling improved predictions of material behavior in extreme conditions. These findings are crucial for designing and processing nanoelectromechanical systems (NEMS).</p></div>","PeriodicalId":456,"journal":{"name":"Acta Mechanica","volume":"236 3","pages":"2171 - 2191"},"PeriodicalIF":2.3000,"publicationDate":"2025-02-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermoelastic and electromagnetic effects in a semiconducting medium\",\"authors\":\"N. Islam, B. Das, G. C. Shit, A. Lahiri\",\"doi\":\"10.1007/s00707-025-04267-z\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>This paper addresses the generalized electromagnetothermoelastic problem for a homogeneous and isotropic thin circular semiconductor. We consider the non-local heat conduction equation due to the miniaturization of modern electronic devices and the prevalent use of ultrashort lasers in environments with extremely high-temperature gradients, along with the presence of a primary electromagnetic field. We assume that while heat propagation exhibits non-local properties, deformation behaves locally. The curved surface of the semiconductor is subjected to an exponentially time-dependent thermal and mechanical load. We employ a finite difference method utilizing the Crank–Nicolson implicit scheme to solve the governing coupled linear equations of hyperbolic type for extremely short-time actions and small microstructured sizes. Our study investigates the impact of the chemical concentration and the physical field variables of the diffusive material to predict the thermoelastic behavior within the nanostructured semiconducting medium. We present numerical computations of the chemical concentration, temperature distribution, chemical potential, deformation, and stress components for fixed values of physical parameters. The results indicate that the non-local parameter significantly smooths out sudden changes in thermal and stress gradients. The phase-lag parameters associated with heat flux and temperature gradient both have finite-speed thermal wave propagation and account for thermal inertia effects. These mechanisms collectively contribute to a reduction in surface resistance. Such factors are essential for precisely capturing ultrashort thermoelastic responses under rapid thermal loading, enabling improved predictions of material behavior in extreme conditions. These findings are crucial for designing and processing nanoelectromechanical systems (NEMS).</p></div>\",\"PeriodicalId\":456,\"journal\":{\"name\":\"Acta Mechanica\",\"volume\":\"236 3\",\"pages\":\"2171 - 2191\"},\"PeriodicalIF\":2.3000,\"publicationDate\":\"2025-02-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Acta Mechanica\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s00707-025-04267-z\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"MECHANICS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Acta Mechanica","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s00707-025-04267-z","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MECHANICS","Score":null,"Total":0}
Thermoelastic and electromagnetic effects in a semiconducting medium
This paper addresses the generalized electromagnetothermoelastic problem for a homogeneous and isotropic thin circular semiconductor. We consider the non-local heat conduction equation due to the miniaturization of modern electronic devices and the prevalent use of ultrashort lasers in environments with extremely high-temperature gradients, along with the presence of a primary electromagnetic field. We assume that while heat propagation exhibits non-local properties, deformation behaves locally. The curved surface of the semiconductor is subjected to an exponentially time-dependent thermal and mechanical load. We employ a finite difference method utilizing the Crank–Nicolson implicit scheme to solve the governing coupled linear equations of hyperbolic type for extremely short-time actions and small microstructured sizes. Our study investigates the impact of the chemical concentration and the physical field variables of the diffusive material to predict the thermoelastic behavior within the nanostructured semiconducting medium. We present numerical computations of the chemical concentration, temperature distribution, chemical potential, deformation, and stress components for fixed values of physical parameters. The results indicate that the non-local parameter significantly smooths out sudden changes in thermal and stress gradients. The phase-lag parameters associated with heat flux and temperature gradient both have finite-speed thermal wave propagation and account for thermal inertia effects. These mechanisms collectively contribute to a reduction in surface resistance. Such factors are essential for precisely capturing ultrashort thermoelastic responses under rapid thermal loading, enabling improved predictions of material behavior in extreme conditions. These findings are crucial for designing and processing nanoelectromechanical systems (NEMS).
期刊介绍:
Since 1965, the international journal Acta Mechanica has been among the leading journals in the field of theoretical and applied mechanics. In addition to the classical fields such as elasticity, plasticity, vibrations, rigid body dynamics, hydrodynamics, and gasdynamics, it also gives special attention to recently developed areas such as non-Newtonian fluid dynamics, micro/nano mechanics, smart materials and structures, and issues at the interface of mechanics and materials. The journal further publishes papers in such related fields as rheology, thermodynamics, and electromagnetic interactions with fluids and solids. In addition, articles in applied mathematics dealing with significant mechanics problems are also welcome.