{"title":"Sn-5Sb/Sn-58Bi混合焊料的显微组织及其与铜的界面反应","authors":"Yue Li, Yu-Ju Li, Man-Hsuan Chung, Chih-Ming Chen","doi":"10.1007/s10854-025-14541-4","DOIUrl":null,"url":null,"abstract":"<div><p>Thermally induced dynamic warpage is a critical reliability issue for large-size and multi-level package structures. Reduction of soldering temperature with low temperature solder (LTS) is a potential solution to reduce the impacts of package warpage. The LTS process is implemented by using a low temperature solder paste screen-printed on the board to bond the ball-grid-array (BGA) solder balls attached on the package side. In this study, eutectic SnBi solder (15.8 mg) was used to bond with Sn-5 wt.% Sb solder ball (22 mg) at 160 °C, 180 °C, and 200 °C for 3 min, after which the microstructural evolution of mixed solder was investigated using microscopic observation and phase diagrams. The mixed solder joined to the Cu substrate was heated at 125 °C for up to 480 h to observe the growth of intermetallic compounds at the joint interface. Fully mixed solder with a composition of Sn-24.3 wt.% Bi-2.9 wt.% Sb was observed at the soldering temperature of 200 °C, producing a two-phase microstructure of bulky (Bi) phase dispersed in the continuous (Sn) matrix in the solidified alloy, with Sb dissolving in the two phases. The Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn phases were formed at the solder/Cu interface, while the Cu<sub>3</sub>Sn phase exhibited a very sluggish growth rate compared to that of Cu<sub>6</sub>Sn<sub>5</sub>. Solid-state aging at 125 °C increased the solubility of Bi in Sn, reducing the quantity of bulky (Bi) particles while producing many fine (Bi) precipitates in the solidified alloy.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 8","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Microstructures of Sn-5Sb/Sn-58Bi mixed solder and its interfacial reaction with copper\",\"authors\":\"Yue Li, Yu-Ju Li, Man-Hsuan Chung, Chih-Ming Chen\",\"doi\":\"10.1007/s10854-025-14541-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Thermally induced dynamic warpage is a critical reliability issue for large-size and multi-level package structures. Reduction of soldering temperature with low temperature solder (LTS) is a potential solution to reduce the impacts of package warpage. The LTS process is implemented by using a low temperature solder paste screen-printed on the board to bond the ball-grid-array (BGA) solder balls attached on the package side. In this study, eutectic SnBi solder (15.8 mg) was used to bond with Sn-5 wt.% Sb solder ball (22 mg) at 160 °C, 180 °C, and 200 °C for 3 min, after which the microstructural evolution of mixed solder was investigated using microscopic observation and phase diagrams. The mixed solder joined to the Cu substrate was heated at 125 °C for up to 480 h to observe the growth of intermetallic compounds at the joint interface. Fully mixed solder with a composition of Sn-24.3 wt.% Bi-2.9 wt.% Sb was observed at the soldering temperature of 200 °C, producing a two-phase microstructure of bulky (Bi) phase dispersed in the continuous (Sn) matrix in the solidified alloy, with Sb dissolving in the two phases. The Cu<sub>6</sub>Sn<sub>5</sub> and Cu<sub>3</sub>Sn phases were formed at the solder/Cu interface, while the Cu<sub>3</sub>Sn phase exhibited a very sluggish growth rate compared to that of Cu<sub>6</sub>Sn<sub>5</sub>. Solid-state aging at 125 °C increased the solubility of Bi in Sn, reducing the quantity of bulky (Bi) particles while producing many fine (Bi) precipitates in the solidified alloy.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"36 8\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2025-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-025-14541-4\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-025-14541-4","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Microstructures of Sn-5Sb/Sn-58Bi mixed solder and its interfacial reaction with copper
Thermally induced dynamic warpage is a critical reliability issue for large-size and multi-level package structures. Reduction of soldering temperature with low temperature solder (LTS) is a potential solution to reduce the impacts of package warpage. The LTS process is implemented by using a low temperature solder paste screen-printed on the board to bond the ball-grid-array (BGA) solder balls attached on the package side. In this study, eutectic SnBi solder (15.8 mg) was used to bond with Sn-5 wt.% Sb solder ball (22 mg) at 160 °C, 180 °C, and 200 °C for 3 min, after which the microstructural evolution of mixed solder was investigated using microscopic observation and phase diagrams. The mixed solder joined to the Cu substrate was heated at 125 °C for up to 480 h to observe the growth of intermetallic compounds at the joint interface. Fully mixed solder with a composition of Sn-24.3 wt.% Bi-2.9 wt.% Sb was observed at the soldering temperature of 200 °C, producing a two-phase microstructure of bulky (Bi) phase dispersed in the continuous (Sn) matrix in the solidified alloy, with Sb dissolving in the two phases. The Cu6Sn5 and Cu3Sn phases were formed at the solder/Cu interface, while the Cu3Sn phase exhibited a very sluggish growth rate compared to that of Cu6Sn5. Solid-state aging at 125 °C increased the solubility of Bi in Sn, reducing the quantity of bulky (Bi) particles while producing many fine (Bi) precipitates in the solidified alloy.
期刊介绍：
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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