柔性铜射频电子器件的混合增材制造

IF 21.1 1区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Today Pub Date : 2025-03-01 DOI:10.1016/j.mattod.2024.12.016

Abdullah Islam , Zhongxuan Wang , Ted Dabrowski , Kalsi Kwan , Saurabh Khuje , Jian Yu , John D. Williams , Shenqiang Ren

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引用次数: 0

摘要

可打印的金属导体，加上强大的机械和热稳定性，在射频电子领域显示出增材制造的潜力。然而，它们的导电性对于实现其在微波通信中的潜力是必不可少的，特别是考虑到微波应用中小型化的基本方面。在此，我们报告了用于制造柔性导体的印刷分子分解铜，其电导率为47 MS/m，接近体铜的81%，用于射频通信和电磁屏蔽（68 dB）。所展示的超薄铜可以激光烧蚀并转移到各种基材（纸，卡普顿®，聚对苯二甲酸乙二醇酯，陶瓷和玻璃）。本文使用的增材制造技术展示了柔性混合射频电子产品可扩展制造的潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Hybrid additive manufacturing of flexible copper radiofrequency electronics

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Hybrid additive manufacturing of flexible copper radiofrequency electronics

Printable metallic conductors, coupled with robust mechanical and thermal stability, exhibit potential for additive manufacturing in radiofrequency electronics. However, their electrical conductivity is indispensable for realizing their potential in microwave communication, particularly considering the essential aspect of miniaturization in microwave applications. Herein we report printed molecular decomposed copper for manufacturing flexible conductors exhibiting an electric conductivity of 47 MS/m nearly 81 % that of bulk copper, for the use in radiofrequency communications and electromagnetic shielding (68 dB). The demonstrated ultra-thin copper can be laser ablated and transferred to a variety of substrate materials (paper, Kapton®, polyethylene terephthalate, ceramics, and glass). Additive manufacturing techniques used herein demonstrate the potential for scalable manufacturing of flexible hybrid radiofrequency electronics.

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来源期刊

Materials Today 工程技术-材料科学：综合

CiteScore

36.30

自引率

1.20%

发文量

237

审稿时长

23 days

期刊介绍： Materials Today is the leading journal in the Materials Today family, focusing on the latest and most impactful work in the materials science community. With a reputation for excellence in news and reviews, the journal has now expanded its coverage to include original research and aims to be at the forefront of the field. We welcome comprehensive articles, short communications, and review articles from established leaders in the rapidly evolving fields of materials science and related disciplines. We strive to provide authors with rigorous peer review, fast publication, and maximum exposure for their work. While we only accept the most significant manuscripts, our speedy evaluation process ensures that there are no unnecessary publication delays.