摘要
本信提出了一种用于固态功率放大器（SSPA）的高效率三路功率合路器。该功率合路器由盖板、印刷电路板和底板组成六端口电路，可实现宽带、高隔离度的三路信号功率合路。与现有的三路功率合路器相比，采用了分支微带线代替分支线之间的隔离电阻，这种结构可以避免电阻损耗，提高功率合路效率。从测量结果来看，三路等效插入损耗小于 4.8 ± 0.2 dB，回波损耗大于 21 dB，6.5 至 8 GHz 的隔离度优于 19 dB。对背靠背样品进行了进一步处理和测试，合路器的功率组合效率达到 94.4% 以上。在该合路器的基础上，开发出了直流效率为 37.5% 的 200 W 固态功率放大器。A high efficiency three-way power combiner used in solid state power amplifier (SSPA) is proposed in this letter. The power combiner is a six ports circuit composing of cover plate, PCB and base plate, which can achieve three-way signals power combining with broadband and high isolation. Compared with the existing three-way power combiner, branch microstrip lines are adopted instead of isolation resistors between branch lines, and this structure can avoid resistance loss and improve power combining efficiency. From the measured results, less than 4.8 ± 0.2 dB of the three equivalent insertion losses, more than 21 dB of the return loss, and better than 19 dB of isolation from 6.5 to 8 GHz can be achieved. Further processing and testing of back-to-back samples were carried out, and the power combining efficiency of the combiner reached over 94.4%. Based on the combiner, a 200 W solid-state power amplifier was developed with a DC efficiency of 37.5%.
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