Bi-2223堆叠导体输运交流损耗的数值与实验研究

IF 1.8 3区 工程技术 Q3 PHYSICS, APPLIED
Jiwei Liu , Yunpeng Zhu , Jing Jiang , Xinsheng Yang , Rui Shen , Lijun Cai , Fanggong Cai , Yong Zhao
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引用次数: 0

摘要

本文建立了Bi-2223堆叠导体的二维多物理场电磁-热耦合模型,该模型将h公式与热传导模块相结合。为了在保证Bi-2223带和铜带数量不变的情况下,优化堆叠结构,采用有限元法对5种不同堆叠方式下Bi-2223堆叠导体中的输运交流电损耗进行了仿真分析。根据优化后的模拟结果,选择3种输运交流损耗较低的堆叠结构,制作成3个长度为500 mm的样品。在三个交流频率(30 Hz、45 Hz和60 Hz)下,通过电测量方法在每个样品的长度方向上以三个不同的间隔测量了输运电流下的交流损耗。通过比较数值模拟结果、实验测量数据和Norris解析公式计算的交流损耗,验证了本文建立的二维多物理场电磁-热耦合模型,该模型可用于计算Bi-2223堆叠导体的输运交流损耗并优化堆叠导体的排列。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Numerical and experimental study of transport AC losses in Bi-2223 stacked conductors
In this paper, a 2D multi-physics electromagnetic-thermal coupling model of Bi-2223 stacked conductors was developed, which combined the H-formulation and heat-conduction module. Using the finite element method (FEM), the transport alternating current (AC) losses in Bi-2223 stacked conductors with five different stacking cases were simulated and analyzed to optimize the stacking structure of the conductors, while ensuring a fixed number of Bi-2223 tapes and copper tapes in the stacked conductors. According to the optimized simulation results, three stacked structures with lower transport AC losses were selected and fabricated into three samples of 500 mm in length. The AC losses with transport current were experimentally measured in three different intervals over the length direction of each sample and at three AC frequencies (30 Hz, 45 Hz, and 60 Hz) by electrical measurement method. By comparing numerical simulation results, experimental measurement data and the AC losses computed with Norris analytical formulation, the 2D multi-physics electromagnetic-thermal coupling model developed in this paper was verified for calculating the transport AC losses of Bi-2223 stacked conductors and optimizing the arrangement of the stacked conductors.
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来源期刊
Cryogenics
Cryogenics 物理-热力学
CiteScore
3.80
自引率
9.50%
发文量
0
审稿时长
2.1 months
期刊介绍: Cryogenics is the world''s leading journal focusing on all aspects of cryoengineering and cryogenics. Papers published in Cryogenics cover a wide variety of subjects in low temperature engineering and research. Among the areas covered are: - Applications of superconductivity: magnets, electronics, devices - Superconductors and their properties - Properties of materials: metals, alloys, composites, polymers, insulations - New applications of cryogenic technology to processes, devices, machinery - Refrigeration and liquefaction technology - Thermodynamics - Fluid properties and fluid mechanics - Heat transfer - Thermometry and measurement science - Cryogenics in medicine - Cryoelectronics
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