基于计算展开的安装应变可调三维保形电子皮肤设计方法

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Shihang Wang, Jie Jin, Weijie Liu, Zheng Xu, Deqing Mei, Yancheng Wang
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引用次数: 0

摘要

三维(3D)保形电子蒙皮(e-蒙皮)已被开发用于匹配不规则表面。采用直接曲面法和尺寸转换法制造的三维保形电子皮肤都需要曲面标定。随着单元数量的增加和安装面形貌的复杂化,曲面标定变得复杂。我们报告了电子皮肤的普遍切割和分销策略。E-skin结合了分层和模块化的触觉传感器,以匹配曲率和尺寸,从而减少安装压力。该策略使三维保形电子皮肤的曲面性能能够通过平面校准结果来表征。举例说明:利用三电平传感器对平面和曲面进行标定。性能变化随传感器尺寸的减小而减小,II级和III级传感单元安装后性能变化较小。它们在曲面上的校准结果被平面上的校准结果所取代,证明了低安装应变有利于三维保形电子皮肤,避免了复杂的曲面校准。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

A computational unfolding-based design method for three-dimensional conformal electronic skin with adjustable mounting strain

A computational unfolding-based design method for three-dimensional conformal electronic skin with adjustable mounting strain

Three-dimensional (3D) conformal electronic skins (E-skins) have been developed for matching the irregularly surfaces. The 3D conformal E-skins manufactured by direct-curved-surface or dimensional converting methods both need curved-surface calibration. With increase of units’ number and complication of mounting-surface morphology, curved-surface calibration becomes intricate. We report a universal cutting and distributing strategy for E-skins. The E-skin incorporates hierarchical and modular tactile sensors to match curvatures and sizes, thereby reducing mounting strain. This strategy enables curved-surface performance of 3D conformal E-skins to be characterized by flat-surface calibration results. An example is provided: Three-level sensors are utilized and calibrated on flat and curved surfaces. Performance variations reduce as sensor size decreases, and performance changes of level II and III sensing units are small after mounting. Their calibration results on curved surface are replaced by those on flat surface, proving low mounting strain facilitates 3D conformal E-skins to avoid complicated curved-surface calibration.

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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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