锗基双金属栅异质介质TFET的离子/离合及跨导优化

IF 2.7 Q2 PHYSICS, CONDENSED MATTER
D. Gracia , D. Jackuline Moni , D. Nirmal
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引用次数: 0

摘要

本研究在TCAD中对双金属栅(DMG)异质介电结构的隧道场效应晶体管(TFET)进行了模拟研究。器件效率指标,如关断状态电流(Ioff)、通断状态电流(Ion)、电流的开关效率(Ion/Ioff)被观察到。并与传统的DMG异质介电MOSFET进行了比较。与传统的DMG异质介电MOSFET相比,推荐器件的亚阈值斜率(SS)降低了74.8%。在相同的环境条件下,与传统的DMG MOSFET相比,Ge沟道TFET的离子/离合比提高了4.669 × 108。对不同沟道厚度(tch)、氧化物厚度(tox)、隧道长度(L1:L2)和不同栅金属工作功能进行了性能分析。对DMG异质介质TFET进行了源区附近有HfO2、漏区附近有SiO2的异质介质的射频分析。很明显,将低k介电体放置在靠近漏极区域的位置可以抑制寄生电容,如Cgd和Cgg。这一特性增强了其作为纳米数字应用的优越抱负的适用性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimisation of Ion/Ioff and transconductance of germanium based dual metal gate hetero-dielectric TFET
This simulation study delves in to the exploration of Tunnel Field Effect Transistors (TFET) with Dual Metal Gate (DMG) hetero-dielectric structure incorporating a Germanium channel using simulations study in TCAD. The device efficiency measures such as current in the off-state (Ioff), on-state current (Ion), switching efficiency of the current (Ion/Ioff) are observed for the proposed device. The metrics are taken in comparison with the traditional DMG hetero-dielectric MOSFET. The recommended device exhibits a 74.8 % reduction in the Subthreshold Slope (SS) compared to the traditional DMG hetero-dielectric MOSFET. An enhanced Ion/Ioff ratio of 4.669 × 108for Ge channel TFET is observed over a conventional DMG MOSFET simulated under same environmental conditions. The performance analysis has been carried out for various channel thickness (tch), oxide thickness (tox), tunneling lengths (L1:L2) and different gate metal work functions. A detailed RF analysis for hetero dielectrics with HfO2 near the source area and SiO2 near the drain area is carried out for DMG Hetero Dielectric TFET. It is evident that positioning the low-k dielectric in close proximity to the drain region leads to the suppression of parasitic capacitances such as Cgd and Cgg. This characteristic enhances its suitability as a superior aspirant for nano digital applications.
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CiteScore
6.50
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