超声振动翅片管式换热器传热参数的GMDH和RSM预测模型

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL
M. Esfandyari , H. Sajjadi , A. Amiri Delouei
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引用次数: 0

摘要

本研究采用数据处理成组方法(GMDH)和响应面法(RSM)对超声振动作用下翅片管式换热器(FTHX)的努塞尔数(Nu)、出口温度、热流和对流换热系数等关键传热参数进行了预测。在不同的进口温度(10-140°C)、流量(2-6 l/min)、风速(0.1-4 m/s)和超声波功率(0或50 W)下进行了实验研究。根据实验数据验证了模型的准确性,相关系数超过0.98。GMDH模型略优于RSM模型。最大绝对平均相对误差(AARE)为0.0633,表明了模型的精度。这些发现为优化热工系统和提高换热器的超声振动传热效率提供了有价值的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
GMDH and RSM models for prediction of heat transfer parameters in an ultrasonic vibrating fin-and-tube heat exchanger
This study employed the Group Method of Data Handling (GMDH) and Response Surface Methodology (RSM) to predict key heat transfer parameters, including the Nusselt number (Nu), outlet temperature, heat flow, and convective heat transfer coefficient in a fin-and-tube heat exchanger (FTHX) subjected to ultrasonic vibrations. Experimental investigations were conducted with varying inlet temperatures (10–140 °C), flow rates (2–6 l/min), air velocities (0.1–4 m/s), and ultrasonic power levels (0 or 50 W). The models’ accuracy was validated against experimental data, showing high correlation coefficients exceeding 0.98. The GMDH model slightly outperformed the RSM model. The maximum absolute average relative error (AARE) was 0.0633, demonstrating the models’ precision. These findings provide valuable insights for optimizing thermal systems and enhancing heat transfer efficiency in heat exchangers through ultrasonic vibration.
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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