用于高密度共封装光学器件的低损耗片对片耦合器

IF 3.3 3区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Advanced Engineering Materials Pub Date : 2025-02-18 DOI:10.1002/adem.202570012

Drew Weninger, Samuel Serna, Luigi Ranno, Lionel Kimerling, Anuradha Agarwal

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引用次数: 0

摘要

共封装光学在2402095号文章中，Drew Weninger， Samuel Serna和同事们展示了一个共封装光学系统，其中一个电子芯片（黑色，中间）被8个硅光子芯片包围。芯片使用自动拾取和放置工具粘合，显示放置最终芯片的位置。自动化是由一种新型的光学芯片对芯片耦合器（绿色标注）实现的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Low Loss Chip-to-Chip Couplers for High-Density Co-Packaged Optics

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Low Loss Chip-to-Chip Couplers for High-Density Co-Packaged Optics

Co-Packaged Optics

In article number 2402095, Drew Weninger, Samuel Serna, and co-workers present a co-packaged optics system with an electrical chip (black, center) surrounded by 8 silicon photonic chips. Chips are bonded using an automated pick-and-place tool, shown placing the final chip into position. The automation is enabled by a novel optical chip-to-chip coupler (green callout).

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来源期刊

Advanced Engineering Materials 工程技术-材料科学：综合

CiteScore

5.70

自引率

5.60%

发文量

544

审稿时长

1.7 months

期刊介绍： Advanced Engineering Materials is the membership journal of three leading European Materials Societies - German Materials Society/DGM, - French Materials Society/SF2M, - Swiss Materials Federation/SVMT.