3纳米纳米片技术中的SRAM和抗噪混合信号逻辑

Rajiv V. Joshi;J. Frougier;Alberto Cestero;Crystal Castellanos;Sudipto Chakraborty;Carl Radens;M. Silvestre;S. Lucarini;I. Ahsan;E. Leobandung
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引用次数: 0

摘要

基于82 Kb/块结构、混合信号逻辑的模块化4.26 Mb SRAM在3nm纳米片(NS)技术中被制造、表征并展示了其完整功能。设计的宏利用新的电路供应增强,读取和写入辅助技术。所提出的电路进行了广泛的评估,并与先前的技术进行了比较。统计模拟用于预测这些电路在双电源使用情况下的好处。通过可编程本地时钟和字线(WL)脉冲宽度,SRAM单元边界和速度通过硬件测量来证明。稳定性辅助和双电源技术用于演示如何在传统存储器操作(单WL开)期间抑制噪声,以及支持混合信号逻辑块操作(多个WL开)。功能显示为0.45 V的电池电源,估计SRAM电池的边际/速度为6 GHz(高密度- 0.026~\mu $ m2,高电流- 0.032~\mu $ m2)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
SRAM and Mixed-Signal Logic With Noise Immunity in 3-nm Nano-Sheet Technology
A modular 4.26 Mb SRAM based on a 82 Kb/block structure with mixed signal logic is fabricated, characterized, and demonstrated with full functionality in a 3-nm nanosheet (NS) technology. Designed macros utilize new circuits for supply boosting, read, and write assist techniques. The proposed circuits are evaluated extensively and compared to prior techniques. Statistical simulations are used to predict the benefits of these circuits in the context of dual supply use. Through programmable local clock and wordline (WL) pulsewidths, SRAM cell margins and speeds are demonstrated through hardware measurement. Stability assists as well as dual supply techniques are used to demonstrate how noise can be suppressed during traditional memory operations (single WL on), as well as to support mixed-signal logic block operation (multiple WLs on). Functionality is shown down to a cell supply of 0.45 V with an estimated margin/speed of 6 GHz for SRAM cells (high density— $0.026~\mu $ m2, and high current— $0.032~\mu $ m2).
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