偏移补偿电荷转移预感测位线感测放大器

IF 4.6 1区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Kyeongtae Nam;Dongil Lee;Kyuchang Kang;Sang-Yun Kim;Changyoung Lee;Hyunchul Yoon;Donggeon Kim;Bokyeon Won;Jae-Joon Song;Jaehyuk Kim;Incheol Nam;Young-Hun Seo;Jeong-Don Ihm;Changsik Yoo;Sangjoon Hwang
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引用次数: 0

摘要

采用14nm动态随机存取存储器(DRAM)工艺实现了一种具有偏移补偿电荷转移预感(OC-CTPS)方案的位线感测放大器(BLSA)。偏移补偿(OC)是由二极管连接操作,没有额外的尺寸开销对于BLSA。在执行OC后,归因于电荷转移(CT)晶体管失配的平均失效位计数(FBC)减少了94%。此外,所提出的OC-CTPS BLSA在温度为$- 25~^{\circ}$ C和$100~^{\circ}$ C的情况下,分别实现了250和500 ps的CT时间($t_{\ mathm {CT}}$)窗口,表示FBC低于标准FBC的$t_{\ mathm {CT}}$区域。此外,与传统的基于锁存器的OC BLSA相比,我们的方法即使在低至0.75 V的工作电压下也能确保鲁棒和稳定的传感。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Offset Compensated Charge Transfer Pre-Sensing Bitline Sense Amplifier
A bitline sense amplifier (BLSA) with offset compensated charge transfer pre-sensing (OC-CTPS) scheme is implemented using 14-nm dynamic random access memory (DRAM) process. The offset compensation (OC) is operated by diode connection without additional size overhead for BLSA. The average fail bit count (FBC) attributed to a mismatch of charge transfer (CT) transistor was reduced by 94% after performing OC. Furthermore, the proposed OC-CTPS BLSA accomplished 250 and 500 ps of CT time ( $t_{\mathrm {CT}}$ ) window, representing the $t_{\mathrm {CT}}$ region where the FBC is lower than the standard FBC, at the temperatures of $- 25~^{\circ }$ C and $100~^{\circ }$ C, respectively, without modifying any operations for CT. Moreover, our approach ensures robust and stable sensing even at operating voltages as low as 0.75 V, compared to conventional latch-based OC BLSA.
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来源期刊
IEEE Journal of Solid-state Circuits
IEEE Journal of Solid-state Circuits 工程技术-工程:电子与电气
CiteScore
11.00
自引率
20.40%
发文量
351
审稿时长
3-6 weeks
期刊介绍: The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.
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