三维层压激光诱导石墨烯纸渗透环氧复合材料的热性能增强

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yong Zhang, Weiwei Liu, Xiaohui Guo, Qixin Zhang, Yan Zhang, Chuan Chen, Liqiang Cao
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引用次数: 0

摘要

在这项工作中,我们研究了激光诱导层压石墨烯纸(LIGP)渗透环氧树脂,以创建具有增强热性能的热压复合材料。通过改变复合材料中环氧树脂的质量百分比和LIGP的层数,考察了影响材料热性能的因素。结果表明:采用20% wt%的环氧树脂和三层LIGP进行热压处理,复合材料的导热系数可达0.6 Wm−1K−1左右。与纯环氧树脂相比,该值大约提高了三倍。此外,我们还进行了有限元分析,以评估LIGP层数对样品导热系数的影响,并为实验观察提供解释。结果表明,激光诱导石墨烯(LIG)在定制聚合物材料的热性能方面具有重要的前景,为高性能热管理应用铺平了道路。这种方法的新颖之处在于利用LIG良好的热性能来开发具有定制热特性的复合材料,这种策略可以重新定义聚合物基材料在管理热能方面的能力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enhanced thermal properties of 3D-laminated laser-induced graphene paper infiltrated epoxy composites

In this work, we investigated the laminated laser-induced graphene paper (LIGP) infiltrated epoxy resin to create hot-pressed composites with enhanced thermal properties. By varying the mass percentage of epoxy resin and the layer number of LIGP in the composites, we examined the factors influencing the thermal properties of the materials. The results indicated that the thermal conductivity of the composites could reach approximately 0.6 Wm−1K−1 when using 20 wt% epoxy resin and three layers of LIGP in the hot-pressing process. This value represents roughly a threefold improvement compared to that of pure epoxy resin. Furthermore, a finite element analysis was conducted to assess the impact of the layer number of LIGP on the samples' thermal conductivity and to provide an explanation for the experimental observations. The results suggest that laser-induced graphene (LIG) holds significant promise for tailoring the thermal properties of polymer materials, paving the way for high-performance thermal management applications. The novelty of this approach lies in leveraging the good thermal properties of LIG to develop composites with tailored thermal characteristics, a strategy that could redefine the capabilities of polymer-based materials in managing thermal energy.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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