通过引入共面终端实现宽带贴片天线

IF 1.1 4区 计算机科学 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC
Boyu Sima, Zhengkun Guo, Run Liu, Heling Gong, Qingqing Yang, Jun Hu, Zhiwei Sun, Wen Wu
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引用次数: 0

摘要

宽带运算是贴片结构研究中的一个重要课题。贴片天线的宽带传输方式多种多样。然而,贴片天线的一些关键优点,如半空间辐射和易于制造,都被降低了。在本研究中,我们参考了平面倒f天线(PIFA)并提出了一种共面终端加载策略,从而得到了一种称为共面终端加载天线(CTLA)的天线模型。它将PIFA中的偶极-背景金属通道转变为CTLA中的偶极-馈入间隙。由于间隙是耦合连接,因此提高了阻抗匹配和谐振频率性能,从而获得更宽的带宽。基于该方法,构建并仿真了原始CTLA、改进CTLA和多径CTLA三个相对带宽分别为63.5%、55%和62%的CTLA。辐射模式是典型的贴片状,在半空间中辐射,在工作波段上混合极化。最后,制作了改进的多路径ctla并进行了测量,验证了该方法的有效性,确保了结果与仿真结果的准确性。本研究提出了一种终端加载贴片结构的方法,从而产生宽带辐射。它可用于宽带相控阵、通信系统等。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Wideband patch antenna through introducing co-plane terminal

Wideband patch antenna through introducing co-plane terminal

Wideband operation is a crucial topic in patch structure research. Various wideband methods have been developed for patch antennas. However, some of the key benefits of patch antennas, such as semi-space radiation and easy fabrication, are degraded. In this study, we refer to the planar inverted-F antenna (PIFA) and propose a co-plane terminal loading strategy, resulting in an antenna model termed the co-plane terminal loaded antenna (CTLA). It transforms the dipole-to-background metallic via in PIFA to a dipole-to-feed gap in CTLA. Because the gap is a coupling connection, the impedance-match and resonant-frequency performance improve, resulting in a wider bandwidth. Based on the proposed approach, three CTLAs, including an original CTLA, an improved CTLA, and a multi-path CTLA, were constructed and simulated, with relative bandwidths of 63.5%, 55%, and 62%, respectively. The radiation pattern is typically patch-like, radiating in semi-space, and hybrid polarisation over the working band. Finally, the improved and multi-path CTLAs are fabricated and measured to validate this method and ensure that the results are consistent with the simulation results accurately. This study proposes a terminal-loading method for patch structures, which results in wideband radiation. It can be used in wideband phased arrays, communication systems etc.

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来源期刊
Iet Microwaves Antennas & Propagation
Iet Microwaves Antennas & Propagation 工程技术-电信学
CiteScore
4.30
自引率
5.90%
发文量
109
审稿时长
7 months
期刊介绍: Topics include, but are not limited to: Microwave circuits including RF, microwave and millimetre-wave amplifiers, oscillators, switches, mixers and other components implemented in monolithic, hybrid, multi-chip module and other technologies. Papers on passive components may describe transmission-line and waveguide components, including filters, multiplexers, resonators, ferrite and garnet devices. For applications, papers can describe microwave sub-systems for use in communications, radar, aerospace, instrumentation, industrial and medical applications. Microwave linear and non-linear measurement techniques. Antenna topics including designed and prototyped antennas for operation at all frequencies; multiband antennas, antenna measurement techniques and systems, antenna analysis and design, aperture antenna arrays, adaptive antennas, printed and wire antennas, microstrip, reconfigurable, conformal and integrated antennas. Computational electromagnetics and synthesis of antenna structures including phased arrays and antenna design algorithms. Radiowave propagation at all frequencies and environments. Current Special Issue. Call for papers: Metrology for 5G Technologies - https://digital-library.theiet.org/files/IET_MAP_CFP_M5GT_SI2.pdf
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