Cu衬底上SnPbInBiSb高熵合金焊接接头中金属间化合物生长动力学

IF 4.7 1区材料科学 Q1 METALLURGY & METALLURGICAL ENGINEERING

Transactions of Nonferrous Metals Society of China Pub Date : 2024-11-01 Epub Date: 2024-12-13 DOI:10.1016/S1003-6326(24)66631-8

Shuai WANG , Jia-yun FENG , Wei WANG , Wen-chao CAO , Xin DING , Shang WANG , Yan-hong TIAN

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引用次数: 0

摘要

研究了Cu/SnPbInBiSb高熵合金焊点界面形成的复杂金属间化合物（IMCs）的生长行为。揭示了IMCs在Cu/SnPbInBiSb固液反应界面的生长抑制机制。结果表明，在Cu/SnPbInBiSb固液反应界面处，复合IMCs的生长速率明显降低。在200℃回流10 min后，IMCs的最大平均厚度仅达1.66 μm。本文从三个方面分析了复合IMCs生长缓慢的机理。首先，液态SnPbInBiSb合金的高熵降低了复合IMCs的生长速度。其次，复合IMCs的畸变晶格抑制了Cu原子的扩散。最后，Cu/SnPbInBiSb固液界面反应的较高活化能（40.9 kJ/mol）从根本上阻碍了配合物IMCs的生长。

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Growth kinetics of interfacial intermetallic compounds formed in SnPbInBiSb high entropy alloy soldered joints on Cu substrates

The growth behavior of the complex intermetallic compounds (IMCs) formed at the interface of Cu/SnPbInBiSb high entropy alloy solder joints was explored. The growth inhibition mechanism of the IMCs at the Cu/SnPbInBiSb solid-liquid reaction interface was revealed. The results showed that the growth rate of the complex IMCs obviously decreased at the Cu/SnPbInBiSb solid-liquid reaction interface. The maximum average thickness of IMCs only reached up to 1.66 μm after reflowing at 200 °C for 10 min. The mechanism for the slow growth of the complex IMCs was analyzed into three aspects. Firstly, the high entropy of the liquid SnPbInBiSb alloy reduced the growth rate of the complex IMCs. Secondly, the distorted lattice of complex IMCs restrained the diffusion of Cu atoms. Lastly, the higher activation energy (40.9 kJ/mol) of Cu/SnPbInBiSb solid-liquid interfacial reaction essentially impeded the growth of the complex IMCs.

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来源期刊

Transactions of Nonferrous Metals Society of China 工程技术-冶金工程

CiteScore

7.40

自引率

17.80%

发文量

8456

审稿时长

3.6 months

期刊介绍： The Transactions of Nonferrous Metals Society of China (Trans. Nonferrous Met. Soc. China), founded in 1991 and sponsored by The Nonferrous Metals Society of China, is published monthly now and mainly contains reports of original research which reflect the new progresses in the field of nonferrous metals science and technology, including mineral processing, extraction metallurgy, metallic materials and heat treatments, metal working, physical metallurgy, powder metallurgy, with the emphasis on fundamental science. It is the unique preeminent publication in English for scientists, engineers, under/post-graduates on the field of nonferrous metals industry. This journal is covered by many famous abstract/index systems and databases such as SCI Expanded, Ei Compendex Plus, INSPEC, CA, METADEX, AJ and JICST.