层间TIG电弧处理对丝弧添加剂合成铜气孔率的影响

IF 1.9 Q3 ENGINEERING, MANUFACTURING

Manufacturing Letters Pub Date : 2025-01-25 DOI:10.1016/j.mfglet.2025.01.002

Arun Kumar Singh, Shubham Sadhya, Sumit Chorma, Indrasen Singh, Yuvraj K Madhukar

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引用次数: 0

摘要

本实验研究探讨了使用TIG （WAAM-TIG）在电弧增材制造中进行层间电弧处理，以最大限度地减少对机械性能不利的孔隙率。由于铜在工业上的广泛利用，本研究选择了铜。在连续（ATC）和脉冲（ATP）模式下进行了WAAM-TIG沉积和层间电弧处理，并将结果与原位制备（AF）样品进行了比较。两种电弧处理样品的孔隙率都有显著降低，但ATP模式表现相对较好，从~ 16%下降到~ 1%。进一步的电弧处理样品也表现出硬度的增加，确保了机械性能的改善。

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Effect of interlayer TIG arc treatment on porosity of wire arc additive manufactured copper

The presented experimental research explores interlayer arc treatment in wire arc additive manufacturing using TIG (WAAM-TIG) to minimise the porosity which adversely affects the mechanical properties. Copper was chosen for this study due to its extensive utilisation in industries. WAAM-TIG deposition along with interlayer arc treatment was performed in continuous (ATC) and pulsed (ATP) mode, and the results were compared with as-fabricated (AF) samples. Both, arc treated samples showed significant reduction in porosity, however, the ATP mode performed relatively better decreasing from ∼ 16 % to ∼ 1 %. Further arc-treated samples were also exhibited an increase in hardness ensuring improvement in mechanical property.

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