mmic用平面堆叠式集成变压器的比较研究

IF 2.2 3区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Mokhtaria Derkaoui , Yamina Benhadda , Azzedine Hamid
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引用次数: 0

摘要

本文对运行在单片微波集成电路(MMIC)上的不同变压器拓扑结构进行了比较研究。对平面堆叠的方形、八角形和圆形线圈拓扑结构进行了研究,以说明其良好的性能。初级线圈和次级线圈尺寸相同,匝数比为1:1。演示了简化的物理等效电路,以评估其元件值。变压器原型采用标准的130纳米CMOS工艺制造。利用COMSOL多物理场分析显示了其电磁和热行为。仿真结果表明,翻转圆形拓扑结构的质量因子得到了改善。由于直角,方形拓扑具有较高的温度和损耗。八角形拓扑结构避免了电流密度在角度上的集中,但由于线段数量多,使得温度升高。在圆形拓扑结构上的插入损耗和耦合系数的测量结果与所提出的模型吻合良好。在不同的外径和宽度下,模拟和测量的震级和相位是相同的。结果表明,圆形拓扑结构的平面变压器具有较高的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparative study of planar stacked integrated transformers for MMICs
This paper describes the comparative study of different transformer topologies operating for Monolithic Microwave Integrated Circuit (MMIC). Planar stacked square, octagonal and circular coil topologies were studied to illustrate the good performance. The primary and secondary coils had the same dimensions with 1:1 turn ratio. The simplified physical equivalent circuit was demonstrated to evaluate its components values. Transformers prototype were fabricated using a standard 130 nm CMOS process. COMSOL Multiphysics analysis was carried out to show the electromagnetic and thermal behaviour. Simulations show quality factor improvements for the flipped circular topology. The square topology presents a high temperature and losses due to the right angles. The octagonal topology avoid to concentrates the current density in the angles but allows to increase the temperature due to the great number of segments. Measurements of insertion loss and coupling factor on circular topology demonstrate the good agreement with the proposed model. Simulated and measured magnitudes and phases for different outer diameter and width are identical. The results revealed that the planar transformer with the circular topology offers high performances.
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来源期刊
Integration-The Vlsi Journal
Integration-The Vlsi Journal 工程技术-工程:电子与电气
CiteScore
3.80
自引率
5.30%
发文量
107
审稿时长
6 months
期刊介绍: Integration''s aim is to cover every aspect of the VLSI area, with an emphasis on cross-fertilization between various fields of science, and the design, verification, test and applications of integrated circuits and systems, as well as closely related topics in process and device technologies. Individual issues will feature peer-reviewed tutorials and articles as well as reviews of recent publications. The intended coverage of the journal can be assessed by examining the following (non-exclusive) list of topics: Specification methods and languages; Analog/Digital Integrated Circuits and Systems; VLSI architectures; Algorithms, methods and tools for modeling, simulation, synthesis and verification of integrated circuits and systems of any complexity; Embedded systems; High-level synthesis for VLSI systems; Logic synthesis and finite automata; Testing, design-for-test and test generation algorithms; Physical design; Formal verification; Algorithms implemented in VLSI systems; Systems engineering; Heterogeneous systems.
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