{"title":"mmic用平面堆叠式集成变压器的比较研究","authors":"Mokhtaria Derkaoui , Yamina Benhadda , Azzedine Hamid","doi":"10.1016/j.vlsi.2025.102346","DOIUrl":null,"url":null,"abstract":"<div><div>This paper describes the comparative study of different transformer topologies operating for Monolithic Microwave Integrated Circuit (MMIC). Planar stacked square, octagonal and circular coil topologies were studied to illustrate the good performance. The primary and secondary coils had the same dimensions with 1:1 turn ratio. The simplified physical equivalent circuit was demonstrated to evaluate its components values. Transformers prototype were fabricated using a standard 130 nm CMOS process. COMSOL Multiphysics analysis was carried out to show the electromagnetic and thermal behaviour. Simulations show quality factor improvements for the flipped circular topology. The square topology presents a high temperature and losses due to the right angles. The octagonal topology avoid to concentrates the current density in the angles but allows to increase the temperature due to the great number of segments. Measurements of insertion loss and coupling factor on circular topology demonstrate the good agreement with the proposed model. Simulated and measured magnitudes and phases for different outer diameter and width are identical. The results revealed that the planar transformer with the circular topology offers high performances.</div></div>","PeriodicalId":54973,"journal":{"name":"Integration-The Vlsi Journal","volume":"102 ","pages":"Article 102346"},"PeriodicalIF":2.2000,"publicationDate":"2025-01-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Comparative study of planar stacked integrated transformers for MMICs\",\"authors\":\"Mokhtaria Derkaoui , Yamina Benhadda , Azzedine Hamid\",\"doi\":\"10.1016/j.vlsi.2025.102346\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>This paper describes the comparative study of different transformer topologies operating for Monolithic Microwave Integrated Circuit (MMIC). Planar stacked square, octagonal and circular coil topologies were studied to illustrate the good performance. The primary and secondary coils had the same dimensions with 1:1 turn ratio. The simplified physical equivalent circuit was demonstrated to evaluate its components values. Transformers prototype were fabricated using a standard 130 nm CMOS process. COMSOL Multiphysics analysis was carried out to show the electromagnetic and thermal behaviour. Simulations show quality factor improvements for the flipped circular topology. The square topology presents a high temperature and losses due to the right angles. The octagonal topology avoid to concentrates the current density in the angles but allows to increase the temperature due to the great number of segments. Measurements of insertion loss and coupling factor on circular topology demonstrate the good agreement with the proposed model. Simulated and measured magnitudes and phases for different outer diameter and width are identical. The results revealed that the planar transformer with the circular topology offers high performances.</div></div>\",\"PeriodicalId\":54973,\"journal\":{\"name\":\"Integration-The Vlsi Journal\",\"volume\":\"102 \",\"pages\":\"Article 102346\"},\"PeriodicalIF\":2.2000,\"publicationDate\":\"2025-01-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Integration-The Vlsi Journal\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0167926025000033\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Integration-The Vlsi Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167926025000033","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
Comparative study of planar stacked integrated transformers for MMICs
This paper describes the comparative study of different transformer topologies operating for Monolithic Microwave Integrated Circuit (MMIC). Planar stacked square, octagonal and circular coil topologies were studied to illustrate the good performance. The primary and secondary coils had the same dimensions with 1:1 turn ratio. The simplified physical equivalent circuit was demonstrated to evaluate its components values. Transformers prototype were fabricated using a standard 130 nm CMOS process. COMSOL Multiphysics analysis was carried out to show the electromagnetic and thermal behaviour. Simulations show quality factor improvements for the flipped circular topology. The square topology presents a high temperature and losses due to the right angles. The octagonal topology avoid to concentrates the current density in the angles but allows to increase the temperature due to the great number of segments. Measurements of insertion loss and coupling factor on circular topology demonstrate the good agreement with the proposed model. Simulated and measured magnitudes and phases for different outer diameter and width are identical. The results revealed that the planar transformer with the circular topology offers high performances.
期刊介绍:
Integration''s aim is to cover every aspect of the VLSI area, with an emphasis on cross-fertilization between various fields of science, and the design, verification, test and applications of integrated circuits and systems, as well as closely related topics in process and device technologies. Individual issues will feature peer-reviewed tutorials and articles as well as reviews of recent publications. The intended coverage of the journal can be assessed by examining the following (non-exclusive) list of topics:
Specification methods and languages; Analog/Digital Integrated Circuits and Systems; VLSI architectures; Algorithms, methods and tools for modeling, simulation, synthesis and verification of integrated circuits and systems of any complexity; Embedded systems; High-level synthesis for VLSI systems; Logic synthesis and finite automata; Testing, design-for-test and test generation algorithms; Physical design; Formal verification; Algorithms implemented in VLSI systems; Systems engineering; Heterogeneous systems.